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1SG280HH3F55E1VGS3 Specifications
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TypeParameter
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Supplier Device Package2912-FBGA, FC (55x55)
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Package / Case2912-BBGA, FCBGA
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Operating Temperature0°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.77V ~ 0.97V
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Number of I/O1160
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Number of Logic Elements/Cells2800000
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Number of LABs/CLBs350000
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesStratix® 10 GX
The 1SG280HH3F55E1VGS3 integrated circuit (IC) chips are part of the Intel Stratix 10 GX FPGA family. These chips offer several advantages and can be applied in various scenarios:1. High-performance computing: The 1SG280HH3F55E1VGS3 chips are designed for high-performance computing applications. They provide high-speed data processing capabilities, making them suitable for tasks that require intensive computational power, such as scientific simulations, data analytics, and machine learning.2. FPGA flexibility: Being FPGA chips, they offer the advantage of reprogrammability. This means that the functionality of the chip can be modified or updated even after deployment, allowing for flexibility in adapting to changing requirements or optimizing performance.3. Acceleration of workloads: The 1SG280HH3F55E1VGS3 chips can be used to accelerate specific workloads by offloading computationally intensive tasks from the CPU to the FPGA. This can result in significant performance improvements and reduced power consumption.4. Networking and telecommunications: These chips are suitable for networking and telecommunications applications. They can be used to implement high-speed data processing, packet routing, encryption/decryption, and other network-related functions.5. Data centers: The high-performance capabilities of the 1SG280HH3F55E1VGS3 chips make them well-suited for data center applications. They can be used to accelerate data processing, improve network performance, and enhance overall data center efficiency.6. Artificial intelligence and deep learning: With their high computational power and reprogrammability, these chips can be utilized in artificial intelligence and deep learning applications. They can accelerate neural network training and inference tasks, enabling faster and more efficient AI algorithms.7. Video and image processing: The 1SG280HH3F55E1VGS3 chips can be employed in video and image processing applications. They can handle real-time video encoding/decoding, image recognition, and other multimedia processing tasks.Overall, the 1SG280HH3F55E1VGS3 integrated circuit chips offer high-performance computing capabilities, FPGA flexibility, and can be applied in various scenarios such as high-performance computing, networking, data centers, AI, and multimedia processing.
