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1SG280HH3F55E1VG Specifications
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TypeParameter
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Supplier Device Package2912-FBGA, FC (55x55)
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Package / Case2912-BBGA, FCBGA
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Operating Temperature0°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.77V ~ 0.97V
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Number of I/O1160
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Number of Logic Elements/Cells2800000
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Number of LABs/CLBs350000
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesStratix® 10 GX
The 1SG280HH3F55E1VG is an integrated circuit (IC) chip from Intel's Stratix 10 GX FPGA family. It is a high-performance FPGA chip with several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The 1SG280HH3F55E1VG chip offers high-performance computing capabilities, making it suitable for demanding applications that require complex calculations and data processing.2. Flexibility: Being an FPGA chip, it provides flexibility in terms of hardware customization and reconfiguration. Users can program the chip to perform specific tasks and algorithms, making it suitable for a wide range of applications.3. Parallel Processing: FPGAs excel at parallel processing, allowing for the execution of multiple tasks simultaneously. This makes them ideal for applications that require high-speed data processing and real-time operations.4. Low Latency: The 1SG280HH3F55E1VG chip offers low-latency performance, enabling quick response times in critical applications such as high-frequency trading, network processing, and real-time signal processing.Application Scenarios: 1. Data Centers: The high-performance computing capabilities of the 1SG280HH3F55E1VG chip make it suitable for data center applications. It can be used for tasks like data analytics, machine learning, and artificial intelligence, where massive parallel processing is required.2. Networking and Telecommunications: The chip's low-latency and high-speed processing capabilities make it well-suited for networking and telecommunications applications. It can be used for tasks like packet processing, network security, and protocol acceleration.3. High-Frequency Trading: The low-latency performance of the chip is crucial in high-frequency trading, where split-second decisions are required for executing trades. It can handle complex algorithms and data processing in real-time, enabling faster trading execution.4. Aerospace and Defense: The 1SG280HH3F55E1VG chip can be used in aerospace and defense applications that require high-performance computing, such as radar systems, signal processing, and image recognition.5. Scientific Research: The chip's parallel processing capabilities make it suitable for scientific research applications that involve complex simulations, data analysis, and modeling.Overall, the 1SG280HH3F55E1VG chip's high performance, flexibility, low latency, and parallel processing capabilities make it a versatile solution for various demanding applications in industries like data centers, networking, finance, aerospace, and scientific research.
