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1SG250HN3F43E2LG Specifications
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TypeParameter
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Supplier Device Package1760-FBGA (42.5x42.5)
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Package / Case1760-BBGA, FCBGA
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Operating Temperature0°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.82V ~ 0.88V
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Number of I/O688
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Number of Logic Elements/Cells2500000
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Number of LABs/CLBs312500
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesStratix® 10 GX
The 1SG250HN3F43E2LG integrated circuit (IC) chips are part of Intel's Stratix 10 GX FPGA family. These chips offer several advantages and can be applied in various scenarios:1. High-performance computing: The 1SG250HN3F43E2LG chips are designed for high-performance computing applications, such as data centers, cloud computing, and scientific research. They provide high-speed processing capabilities, enabling complex calculations and data-intensive tasks.2. Accelerated data processing: With their Field-Programmable Gate Array (FPGA) architecture, these chips can be programmed and reprogrammed to accelerate specific data processing tasks. This flexibility allows for optimized performance in applications like machine learning, artificial intelligence, and big data analytics.3. Low-latency communication: The 1SG250HN3F43E2LG chips support high-speed serial transceivers, enabling low-latency communication between different components or systems. This makes them suitable for applications that require real-time data transfer, such as high-frequency trading, telecommunications, and network infrastructure.4. Customizable hardware acceleration: The FPGA architecture of these chips allows users to design and implement custom hardware accelerators tailored to their specific needs. This capability is beneficial in scenarios where off-the-shelf solutions may not provide the required performance or efficiency, such as cryptography, image processing, or signal processing.5. Power efficiency: The 1SG250HN3F43E2LG chips are designed to deliver high performance while maintaining power efficiency. This makes them suitable for applications where power consumption is a concern, such as mobile devices, edge computing, or Internet of Things (IoT) devices.Overall, the 1SG250HN3F43E2LG integrated circuit chips offer high-performance computing capabilities, accelerated data processing, low-latency communication, customizable hardware acceleration, and power efficiency. These features make them suitable for a wide range of applications across industries.
