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1SG250HU3F50I3VG Specifications
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TypeParameter
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Supplier Device Package2397-FBGA, FC (50x50)
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Package / Case2397-BBGA, FCBGA
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Operating Temperature-40°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.77V ~ 0.97V
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Number of I/O704
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Number of Logic Elements/Cells2500000
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Number of LABs/CLBs312500
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesStratix® 10 GX
The 1SG250HU3F50I3VG is an integrated circuit (IC) chip from Intel's Stratix 10 GX FPGA family. It is a high-performance FPGA chip with several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The 1SG250HU3F50I3VG chip offers high-performance computing capabilities, making it suitable for demanding applications that require complex calculations and data processing.2. Flexibility: Being an FPGA chip, it provides flexibility in terms of hardware customization and reconfiguration. Users can program the chip to perform specific tasks and algorithms, making it suitable for a wide range of applications.3. Parallel Processing: FPGAs excel at parallel processing, allowing for the execution of multiple tasks simultaneously. This makes them ideal for applications that require high-speed data processing and real-time operations.4. Low Latency: The 1SG250HU3F50I3VG chip offers low-latency performance, enabling quick response times in critical applications such as high-frequency trading, network processing, and real-time signal processing.Application Scenarios: 1. Data Centers: The high-performance computing capabilities of the 1SG250HU3F50I3VG chip make it suitable for data center applications. It can be used for tasks like data analytics, machine learning, and artificial intelligence, where parallel processing and high-speed calculations are crucial.2. Networking and Telecommunications: The chip's low-latency performance and parallel processing capabilities make it well-suited for networking and telecommunications applications. It can be used for tasks like packet processing, network security, and protocol acceleration.3. High-Frequency Trading: The low-latency and high-performance features of the chip make it suitable for high-frequency trading applications. It can be used for algorithmic trading, market data analysis, and order book management, where quick response times are critical.4. Aerospace and Defense: The 1SG250HU3F50I3VG chip's high-performance computing capabilities and flexibility make it suitable for aerospace and defense applications. It can be used for tasks like radar signal processing, image and video processing, and communication systems.5. Scientific Research: The chip's high-performance computing capabilities can be utilized in scientific research applications, such as simulations, modeling, and data analysis, where complex calculations and parallel processing are required.Overall, the 1SG250HU3F50I3VG chip's advantages and application scenarios make it a versatile and powerful solution for various industries that require high-performance computing, low latency, and flexibility.
