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1SG165HU2F50E2VG Specifications
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TypeParameter
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Number of LABs/CLBs206250
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Supplier Device Package2397-FBGA, FC (50x50)
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Package / Case2397-BBGA, FCBGA
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Operating Temperature0°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.77V ~ 0.97V
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Number of I/O704
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Number of Logic Elements/Cells1650000
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesStratix® 10 GX
The 1SG165HU2F50E2VG is an integrated circuit (IC) chip manufactured by Intel. It belongs to the Intel Stratix 10 GX FPGA family and offers several advantages and application scenarios. Here are some of them:Advantages: 1. High-performance FPGA: The 1SG165HU2F50E2VG chip is built on Intel's Stratix 10 architecture, which provides high-performance capabilities for various applications. 2. Large capacity: It offers a large number of programmable logic elements, memory blocks, and DSP blocks, allowing for complex designs and computations. 3. High-speed interfaces: The chip supports high-speed interfaces like PCIe Gen3 x16, which enables fast data transfer rates. 4. Low power consumption: Despite its high performance, the chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 5. Security features: The 1SG165HU2F50E2VG chip includes security features like secure boot and anti-tamper protection, ensuring the integrity and confidentiality of the design.Application scenarios: 1. Data centers: The high-performance and low-power characteristics of the chip make it suitable for data center applications, such as acceleration of machine learning algorithms, network processing, and data analytics. 2. High-frequency trading: The chip's fast data transfer capabilities and high-performance computing make it ideal for applications in the financial sector, where low-latency and high-speed processing are crucial. 3. Aerospace and defense: The security features of the chip make it suitable for applications in aerospace and defense, such as secure communication systems, radar processing, and encryption/decryption. 4. 5G wireless communication: The chip's high-speed interfaces and programmable logic elements can be utilized for implementing baseband processing, beamforming, and other functions in 5G wireless communication systems. 5. Video processing and broadcasting: The large capacity and high-performance computing capabilities of the chip can be leveraged for video processing, encoding, decoding, and broadcasting applications.These are just a few examples of the advantages and application scenarios of the 1SG165HU2F50E2VG integrated circuit chip. The versatility and flexibility of FPGA technology allow for a wide range of applications across various industries.
