1SG210HU3F50E2VG

1SG210HU3F50E2VG

Manufacturer No:

1SG210HU3F50E2VG

Manufacturer:

Intel

Description:

IC FPGA 704 I/O 2397BGA

Datasheet:

Datasheet

Delivery:

Payment:

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1SG210HU3F50E2VG Specifications

  • Type
    Parameter
  • Number of LABs/CLBs
    262500
  • Supplier Device Package
    2397-FBGA, FC (50x50)
  • Package / Case
    2397-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.77V ~ 0.97V
  • Number of I/O
    704
  • Number of Logic Elements/Cells
    2100000
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Stratix® 10 GX
The 1SG210HU3F50E2VG integrated circuit (IC) chips are part of the Intel Stratix 10 GX FPGA family. These chips offer several advantages and can be applied in various scenarios:1. High-performance computing: The 1SG210HU3F50E2VG chips are designed for high-performance computing applications, such as data centers, cloud computing, and scientific research. They provide high-speed processing capabilities and can handle complex computational tasks efficiently.2. Accelerated computing: These chips are suitable for applications that require accelerated computing, such as machine learning, artificial intelligence, and deep learning. They offer high-performance processing and can accelerate the execution of computationally intensive algorithms.3. Networking and telecommunications: The 1SG210HU3F50E2VG chips can be used in networking and telecommunications equipment, including routers, switches, and base stations. They provide high-speed data processing and can handle large volumes of network traffic effectively.4. Financial services: These chips are well-suited for financial services applications, such as high-frequency trading, risk analysis, and algorithmic trading. They offer low-latency processing and high-speed data transfer, enabling real-time analysis and decision-making.5. Video and image processing: The 1SG210HU3F50E2VG chips can be applied in video and image processing systems, including video surveillance, video encoding/decoding, and image recognition. They provide high-performance processing and can handle large amounts of multimedia data efficiently.6. Aerospace and defense: These chips are suitable for aerospace and defense applications, such as radar systems, signal processing, and secure communications. They offer high-speed processing and can handle complex algorithms required in these domains.Overall, the 1SG210HU3F50E2VG IC chips provide high-performance computing capabilities, making them ideal for applications that require accelerated processing, high-speed data transfer, and complex algorithm execution.