1SG280HN3F43E2VG

1SG280HN3F43E2VG

Manufacturer No:

1SG280HN3F43E2VG

Manufacturer:

Intel

Description:

IC FPGA 688 I/O 1760FBGA

Datasheet:

Datasheet

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1SG280HN3F43E2VG Specifications

  • Type
    Parameter
  • Supplier Device Package
    1760-FBGA (42.5x42.5)
  • Package / Case
    1760-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.77V ~ 0.97V
  • Number of I/O
    688
  • Number of Logic Elements/Cells
    2800000
  • Number of LABs/CLBs
    350000
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Stratix® 10 GX
The 1SG280HN3F43E2VG is an integrated circuit (IC) chip from Intel's Stratix 10 GX FPGA family. It is a high-performance programmable logic device that offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the 1SG280HN3F43E2VG IC chip are:Advantages: 1. High Performance: The 1SG280HN3F43E2VG chip provides high-speed processing capabilities, making it suitable for applications that require complex computations and real-time data processing. 2. Programmability: Being an FPGA, the chip is highly programmable, allowing users to customize its functionality according to their specific requirements. This flexibility makes it suitable for a wide range of applications. 3. Parallel Processing: FPGAs excel at parallel processing, enabling the execution of multiple tasks simultaneously. This makes the 1SG280HN3F43E2VG chip ideal for applications that require high throughput and parallel computations. 4. Low Latency: The chip offers low-latency performance, ensuring quick response times for time-critical applications. 5. Power Efficiency: The 1SG280HN3F43E2VG chip is designed to be power-efficient, enabling energy-saving operation in various applications.Application Scenarios: 1. Data Centers: The high-performance and parallel processing capabilities of the 1SG280HN3F43E2VG chip make it suitable for data center applications. It can be used for tasks like data analytics, machine learning, and network acceleration. 2. High-Frequency Trading: The low-latency and high-speed processing capabilities of the chip make it well-suited for high-frequency trading applications, where quick decision-making and execution are crucial. 3. Video Processing: The programmability and parallel processing capabilities of the 1SG280HN3F43E2VG chip make it suitable for video processing applications. It can be used for tasks like video encoding, decoding, transcoding, and real-time video analytics. 4. Aerospace and Defense: The chip's high-performance computing capabilities make it suitable for aerospace and defense applications, such as radar signal processing, image recognition, and communication systems. 5. 5G Network Infrastructure: The 1SG280HN3F43E2VG chip can be used in 5G network infrastructure for tasks like baseband processing, beamforming, and network acceleration, thanks to its high-speed processing and low-latency capabilities.These are just a few examples of the advantages and application scenarios of the 1SG280HN3F43E2VG IC chip. Its flexibility and high-performance characteristics make it suitable for a wide range of applications in various industries.