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1SG280HN3F43E2VGS3 Specifications
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TypeParameter
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Supplier Device Package1760-FBGA (42.5x42.5)
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Package / Case1760-BBGA, FCBGA
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Operating Temperature0°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.77V ~ 0.97V
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Number of I/O688
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Number of Logic Elements/Cells2800000
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Number of LABs/CLBs350000
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesStratix® 10 GX
The 1SG280HN3F43E2VGS3 is an integrated circuit (IC) chip from Intel's Stratix 10 GX FPGA family. It is a highly advanced and powerful FPGA chip with several advantages and application scenarios. Some of them include:1. High Performance: The 1SG280HN3F43E2VGS3 chip offers high-performance computing capabilities, making it suitable for demanding applications that require complex calculations and data processing.2. Flexibility: Being an FPGA chip, it provides flexibility in hardware design and customization. Users can program the chip to perform specific functions and algorithms, making it adaptable to a wide range of applications.3. Parallel Processing: FPGAs excel at parallel processing, allowing for the execution of multiple tasks simultaneously. This makes them ideal for applications that require high-speed data processing, such as image and video processing, cryptography, and real-time signal processing.4. Low Latency: The 1SG280HN3F43E2VGS3 chip offers low latency, enabling real-time processing and response in time-critical applications. This makes it suitable for applications like high-frequency trading, network packet processing, and telecommunications.5. High Bandwidth: With its high-speed transceivers and advanced I/O capabilities, the chip can handle high-bandwidth data transfer, making it suitable for applications that require large data throughput, such as data centers, networking equipment, and high-performance computing clusters.6. Security: The 1SG280HN3F43E2VGS3 chip incorporates security features like secure boot, encrypted configuration bitstream, and physical design security, making it suitable for applications that require secure and tamper-resistant hardware, such as military systems, aerospace, and financial services.Application scenarios for the 1SG280HN3F43E2VGS3 chip include:1. Data Centers: The chip can be used in data centers for tasks like data compression, encryption, and network packet processing, improving overall performance and efficiency.2. High-Frequency Trading: Its low latency and high-speed processing capabilities make it suitable for high-frequency trading systems, where quick decision-making and execution are crucial.3. Video and Image Processing: The chip's parallel processing capabilities make it ideal for video and image processing applications, such as video transcoding, computer vision, and real-time video analytics.4. Network Infrastructure: It can be used in networking equipment like routers, switches, and firewalls to handle high-bandwidth data traffic, ensuring efficient data transfer and network management.5. Aerospace and Defense: The chip's security features and high-performance computing capabilities make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communication systems.6. Scientific Research: The chip's high-performance computing capabilities can be utilized in scientific research applications, such as simulations, modeling, and data analysis.Overall, the 1SG280HN3F43E2VGS3 chip offers a combination of high performance, flexibility, low latency, and security, making it suitable for a wide range of applications that require advanced computing capabilities.
