1SG280HH3F55E2VG

1SG280HH3F55E2VG

Manufacturer No:

1SG280HH3F55E2VG

Manufacturer:

Intel

Description:

IC FPGA 1160 I/O 2912BGA

Datasheet:

Datasheet

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1SG280HH3F55E2VG Specifications

  • Type
    Parameter
  • Supplier Device Package
    2912-FBGA, FC (55x55)
  • Package / Case
    2912-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.77V ~ 0.97V
  • Number of I/O
    1160
  • Number of Logic Elements/Cells
    2800000
  • Number of LABs/CLBs
    350000
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Stratix® 10 GX
The 1SG280HH3F55E2VG integrated circuit (IC) chips are part of Intel's Stratix 10 GX FPGA family. These chips offer several advantages and can be applied in various scenarios:1. High-performance computing: The 1SG280HH3F55E2VG chips are designed for high-performance computing applications, such as data centers, cloud computing, and scientific research. They provide high-speed processing capabilities and can handle complex computational tasks efficiently.2. Accelerated data processing: These chips are equipped with advanced FPGA technology, allowing for accelerated data processing. They can be used in applications that require real-time data analysis, such as financial trading, network security, and machine learning.3. Customizable hardware acceleration: The FPGA architecture of these chips enables users to customize and accelerate specific algorithms or functions. This flexibility makes them suitable for applications that require hardware acceleration, such as video processing, cryptography, and signal processing.4. High-speed connectivity: The 1SG280HH3F55E2VG chips support high-speed connectivity interfaces, including PCIe Gen3 x16, 100Gb Ethernet, and DDR4 memory interfaces. This makes them ideal for applications that demand high-bandwidth data transfer, such as network switches, routers, and storage systems.5. Low power consumption: Despite their high-performance capabilities, these chips are designed to be power-efficient. They incorporate power management features that optimize power consumption, making them suitable for applications with strict power constraints, such as portable devices and edge computing.6. Reconfigurable hardware: The FPGA nature of these chips allows for reconfiguration of the hardware, enabling users to adapt and update their designs without changing the physical components. This makes them suitable for applications that require frequent updates or customization, such as prototyping, research, and development.Overall, the 1SG280HH3F55E2VG IC chips offer high-performance computing, accelerated data processing, customizable hardware acceleration, high-speed connectivity, low power consumption, and reconfigurable hardware. These features make them suitable for a wide range of applications in various industries.