5SGXMABN3F45C4G

5SGXMABN3F45C4G

Manufacturer No:

5SGXMABN3F45C4G

Manufacturer:

Intel

Description:

IC FPGA 840 I/O 1932FBGA

Datasheet:

Datasheet

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5SGXMABN3F45C4G Specifications

  • Type
    Parameter
  • Supplier Device Package
    1932-FBGA, FC (45x45)
  • Package / Case
    1932-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.82V ~ 0.88V
  • Number of I/O
    840
  • Total RAM Bits
    53248000
  • Number of Logic Elements/Cells
    952000
  • Number of LABs/CLBs
    359200
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Stratix® V GX
The 5SGXMABN3F45C4G is an integrated circuit chip from Intel's Stratix V series of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The 5SGXMABN3F45C4G chip offers high-performance capabilities with a maximum operating frequency of up to 550 MHz. It provides fast processing speeds and efficient execution of complex algorithms. 2. Flexibility: Being an FPGA, it offers reprogrammable logic, allowing users to modify and update the chip's functionality even after deployment. This flexibility makes it suitable for a wide range of applications. 3. High Logic Density: With a logic density of 462,000 logic elements, the chip can accommodate complex designs and implement multiple functionalities on a single device. 4. Low Power Consumption: The 5SGXMABN3F45C4G chip is designed to be power-efficient, making it suitable for applications where power consumption is a critical factor. 5. Rich Set of Features: It includes various features like high-speed transceivers, embedded memory blocks, digital signal processing (DSP) blocks, and high-speed I/O interfaces, enabling the implementation of diverse applications.Application Scenarios: 1. Communications and Networking: The high-performance and low-latency capabilities of the 5SGXMABN3F45C4G chip make it suitable for applications in telecommunications, networking, and data centers. It can be used for packet processing, protocol conversion, encryption/decryption, and network acceleration. 2. Aerospace and Defense: The chip's high logic density and reprogrammability make it ideal for aerospace and defense applications. It can be used for radar and sonar signal processing, software-defined radios, image and video processing, and encryption/decryption in secure communication systems. 3. High-Performance Computing: The 5SGXMABN3F45C4G chip's high-performance capabilities make it suitable for high-performance computing applications. It can be used for accelerating computationally intensive tasks, such as scientific simulations, financial modeling, and data analytics. 4. Industrial Automation: The chip's flexibility and high-speed I/O interfaces make it suitable for industrial automation applications. It can be used for real-time control, motor control, machine vision, and industrial networking. 5. Medical Imaging: The high-performance and DSP capabilities of the chip make it suitable for medical imaging applications. It can be used for real-time image processing, ultrasound imaging, and computed tomography (CT) reconstruction.These are just a few examples of the advantages and application scenarios of the 5SGXMABN3F45C4G chip. Its versatility and high-performance capabilities make it suitable for a wide range of applications across various industries.