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1SG250HU3F50E3VG Specifications
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TypeParameter
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Supplier Device Package2397-FBGA, FC (50x50)
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Package / Case2397-BBGA, FCBGA
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Operating Temperature0°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.77V ~ 0.97V
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Number of I/O704
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Number of Logic Elements/Cells2500000
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Number of LABs/CLBs312500
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesStratix® 10 GX
The 1SG250HU3F50E3VG is an integrated circuit (IC) chip from Intel's Stratix 10 GX FPGA family. It is a high-performance FPGA chip with several advantages and application scenarios. Some of them include:1. High-performance computing: The 1SG250HU3F50E3VG chip offers high-speed processing capabilities, making it suitable for applications that require intensive computational tasks. It can be used in areas like scientific research, data analytics, and financial modeling.2. Data center acceleration: With its FPGA architecture, the chip can be used to accelerate various workloads in data centers. It enables the offloading of specific tasks from CPUs, resulting in improved performance and energy efficiency. Applications like machine learning, artificial intelligence, and network acceleration can benefit from this chip.3. Network infrastructure: The 1SG250HU3F50E3VG chip can be used in networking equipment to enhance performance and flexibility. It can handle complex packet processing tasks, protocol offloading, and network security functions. This makes it suitable for routers, switches, and other network appliances.4. Wireless communication: The chip's high-speed processing and programmability make it suitable for wireless communication applications. It can be used in base stations, wireless access points, and other wireless infrastructure equipment to handle signal processing, modulation/demodulation, and protocol implementation.5. Video and image processing: The 1SG250HU3F50E3VG chip's parallel processing capabilities make it ideal for video and image processing applications. It can be used in video encoders/decoders, image recognition systems, and video analytics platforms to accelerate computations and improve performance.6. Aerospace and defense: The chip's high-performance computing capabilities and reliability make it suitable for aerospace and defense applications. It can be used in radar systems, signal processing, encryption, and other critical tasks that require real-time processing and high security.Overall, the 1SG250HU3F50E3VG chip's advantages lie in its high-performance computing capabilities, flexibility, and programmability. Its application scenarios range from data centers and networking to wireless communication, video processing, and aerospace/defense.
