1SG250HN3F43E2VG

1SG250HN3F43E2VG

Manufacturer No:

1SG250HN3F43E2VG

Manufacturer:

Intel

Description:

IC FPGA 688 I/O 1760FBGA

Datasheet:

Datasheet

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1SG250HN3F43E2VG Specifications

  • Type
    Parameter
  • Supplier Device Package
    1760-FBGA (42.5x42.5)
  • Package / Case
    1760-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.77V ~ 0.97V
  • Number of I/O
    688
  • Number of Logic Elements/Cells
    2500000
  • Number of LABs/CLBs
    312500
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Stratix® 10 GX
The 1SG250HN3F43E2VG is an integrated circuit (IC) chip from Intel's Stratix 10 GX FPGA family. It is a high-performance programmable logic device that offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the 1SG250HN3F43E2VG IC chip are:Advantages: 1. High Performance: The 1SG250HN3F43E2VG chip provides high-speed processing capabilities, making it suitable for applications that require complex computations and real-time data processing. 2. Programmability: Being an FPGA, the chip is highly programmable, allowing users to customize its functionality according to their specific requirements. This flexibility makes it suitable for a wide range of applications. 3. Parallel Processing: FPGAs excel at parallel processing, enabling the execution of multiple tasks simultaneously. This makes them ideal for applications that require high throughput and parallel computations. 4. Low Latency: The 1SG250HN3F43E2VG chip offers low-latency performance, making it suitable for applications that require quick response times, such as high-frequency trading, network processing, and real-time signal processing. 5. Power Efficiency: Intel's Stratix 10 GX FPGAs are designed to be power-efficient, allowing for high-performance computations while minimizing power consumption.Application Scenarios: 1. Data Centers: The high-performance and power-efficient nature of the 1SG250HN3F43E2VG chip make it suitable for data center applications. It can be used for tasks like data analytics, machine learning, and network processing. 2. High-Frequency Trading: The low-latency capabilities of the chip make it well-suited for high-frequency trading applications, where quick response times are crucial for executing trades. 3. Aerospace and Defense: The programmability and parallel processing capabilities of the 1SG250HN3F43E2VG chip make it suitable for aerospace and defense applications. It can be used for tasks like radar signal processing, image and video processing, and communication systems. 4. Telecommunications: The chip's high-performance and power efficiency make it suitable for telecommunications applications, such as base station processing, network acceleration, and protocol offloading. 5. Scientific Research: The 1SG250HN3F43E2VG chip can be used in scientific research applications that require high-performance computing, such as simulations, data analysis, and computational modeling.These are just a few examples of the advantages and application scenarios of the 1SG250HN3F43E2VG IC chip. Its versatility and programmability make it suitable for a wide range of industries and applications that require high-performance processing capabilities.