5SGXMA7H3F35I3LG

5SGXMA7H3F35I3LG

Manufacturer No:

5SGXMA7H3F35I3LG

Manufacturer:

Intel

Description:

IC FPGA 552 I/O 1152FBGA

Datasheet:

Datasheet

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5SGXMA7H3F35I3LG Specifications

  • Type
    Parameter
  • Supplier Device Package
    1152-FBGA (35x35)
  • Package / Case
    1152-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.82V ~ 0.88V
  • Number of I/O
    552
  • Total RAM Bits
    51200000
  • Number of Logic Elements/Cells
    622000
  • Number of LABs/CLBs
    234720
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Stratix® V GX
The 5SGXMA7H3F35I3LG is a specific model of integrated circuit chip from Intel's Stratix V series. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The 5SGXMA7H3F35I3LG chip offers high-performance capabilities, including a high-speed transceiver interface, high-speed memory, and advanced DSP blocks. This makes it suitable for demanding applications that require fast processing and data transfer.2. FPGA Architecture: This chip is based on Field-Programmable Gate Array (FPGA) technology, which allows for flexible and customizable hardware designs. Users can program the chip to perform specific functions, making it suitable for a wide range of applications.3. Low Power Consumption: Despite its high performance, the 5SGXMA7H3F35I3LG chip is designed to be power-efficient. It incorporates power-saving features and optimization techniques, making it suitable for applications where power consumption is a concern.4. Large Capacity: This chip offers a large amount of programmable logic and memory resources, allowing for complex designs and data-intensive applications. It can handle a significant number of input/output connections and support multiple interfaces simultaneously.Application Scenarios: 1. Communications and Networking: The high-speed transceiver interface and large capacity of the 5SGXMA7H3F35I3LG chip make it suitable for applications in telecommunications, networking, and data centers. It can be used for tasks such as packet processing, encryption/decryption, and protocol conversion.2. High-Performance Computing: The chip's high-performance capabilities and large capacity make it suitable for applications in high-performance computing (HPC) environments. It can be used for tasks such as data analytics, scientific simulations, and image processing.3. Video and Image Processing: The advanced DSP blocks and high-speed memory of the chip make it suitable for video and image processing applications. It can be used for tasks such as video encoding/decoding, image recognition, and real-time video processing.4. Industrial Automation: The flexibility and programmability of the chip make it suitable for industrial automation applications. It can be used for tasks such as control systems, motor control, and sensor interfacing.5. Defense and Aerospace: The chip's high performance, low power consumption, and ruggedness make it suitable for defense and aerospace applications. It can be used for tasks such as radar signal processing, satellite communication, and avionics systems.These are just a few examples of the advantages and application scenarios of the 5SGXMA7H3F35I3LG integrated circuit chip. The actual usage depends on the specific requirements and design considerations of the application.