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1SG280HN3F43E3VGS3 Specifications
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TypeParameter
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Supplier Device Package1760-FBGA (42.5x42.5)
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Package / Case1760-BBGA, FCBGA
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Operating Temperature0°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.77V ~ 0.97V
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Number of I/O688
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Number of Logic Elements/Cells2800000
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Number of LABs/CLBs350000
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesStratix® 10 GX
The 1SG280HN3F43E3VGS3 is an integrated circuit (IC) chip from Intel's Stratix 10 GX FPGA family. It is a high-performance programmable logic device that offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of this chip are:Advantages: 1. High Performance: The 1SG280HN3F43E3VGS3 chip provides high-performance computing capabilities, making it suitable for demanding applications that require fast processing speeds.2. Programmability: Being an FPGA, the chip is highly programmable, allowing users to customize its functionality according to their specific requirements. This flexibility makes it suitable for a wide range of applications.3. Integration: The chip integrates various components, including programmable logic, high-speed transceivers, memory, and digital signal processing (DSP) blocks. This integration simplifies system design and reduces the need for external components.4. Power Efficiency: The 1SG280HN3F43E3VGS3 chip is designed to be power-efficient, enabling energy-saving operation in applications where power consumption is a concern.Application Scenarios: 1. Data Centers: The high-performance computing capabilities of the 1SG280HN3F43E3VGS3 chip make it suitable for data center applications. It can be used for tasks like data processing, network acceleration, and artificial intelligence (AI) inference.2. Communications: The chip's integrated high-speed transceivers make it suitable for communication applications, such as wireless base stations, network switches, and routers. It can handle high-speed data transmission and processing.3. Aerospace and Defense: The 1SG280HN3F43E3VGS3 chip's high-performance computing and programmability make it suitable for aerospace and defense applications. It can be used in radar systems, satellite communication, signal processing, and encryption.4. High-Performance Computing: The chip's capabilities make it suitable for high-performance computing applications, such as scientific simulations, financial modeling, and data analytics. It can handle complex calculations and data processing tasks efficiently.5. Industrial Automation: The 1SG280HN3F43E3VGS3 chip can be used in industrial automation applications, such as robotics, machine vision, and control systems. Its programmability allows for customization and adaptation to specific automation requirements.Overall, the 1SG280HN3F43E3VGS3 chip's high performance, programmability, integration, and power efficiency make it suitable for a wide range of applications, including data centers, communications, aerospace and defense, high-performance computing, and industrial automation.
