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1SG280HN3F43E3VG Specifications
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TypeParameter
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Supplier Device Package1760-FBGA (42.5x42.5)
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Package / Case1760-BBGA, FCBGA
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Operating Temperature0°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.77V ~ 0.97V
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Number of I/O688
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Number of Logic Elements/Cells2800000
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Number of LABs/CLBs350000
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesStratix® 10 GX
The 1SG280HN3F43E3VG is an integrated circuit (IC) chip from Intel's Stratix 10 GX FPGA family. It is a high-performance programmable logic device that offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the 1SG280HN3F43E3VG IC chip are:Advantages: 1. High Performance: The 1SG280HN3F43E3VG chip provides high-speed processing capabilities, making it suitable for applications that require complex computations and real-time data processing. 2. Programmability: Being an FPGA, the chip is highly programmable, allowing users to customize its functionality according to their specific requirements. This flexibility makes it suitable for a wide range of applications. 3. Parallel Processing: FPGAs excel at parallel processing tasks, enabling the chip to handle multiple tasks simultaneously. This makes it ideal for applications that require high throughput and parallel computations. 4. Low Latency: The 1SG280HN3F43E3VG chip offers low latency, ensuring quick response times for time-critical applications. 5. Power Efficiency: Intel's Stratix 10 GX FPGAs are designed to be power-efficient, allowing for optimal performance while minimizing power consumption.Application Scenarios: 1. Data Centers: The high-performance and parallel processing capabilities of the 1SG280HN3F43E3VG chip make it suitable for data center applications. It can be used for tasks like data analytics, machine learning, and network acceleration. 2. High-Frequency Trading: The low latency and high-speed processing of the chip make it well-suited for high-frequency trading applications, where quick decision-making and low-latency data processing are crucial. 3. Aerospace and Defense: The programmability and high-performance features of the chip make it suitable for aerospace and defense applications. It can be used for tasks like radar signal processing, image and video processing, and communication systems. 4. Telecommunications: The 1SG280HN3F43E3VG chip can be used in telecommunications infrastructure for tasks like packet processing, encryption/decryption, and protocol handling. 5. Artificial Intelligence: With its parallel processing capabilities, the chip can be utilized in AI applications, including deep learning, neural networks, and computer vision.These are just a few examples of the advantages and application scenarios of the 1SG280HN3F43E3VG IC chip. Its versatility and high-performance features make it suitable for a wide range of applications in various industries.
