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1SG210HN3F43E2VG Specifications
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TypeParameter
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Supplier Device Package1760-FBGA (42.5x42.5)
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Package / Case1760-BBGA, FCBGA
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Operating Temperature0°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.77V ~ 0.97V
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Number of I/O688
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Number of Logic Elements/Cells2100000
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Number of LABs/CLBs262500
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesStratix® 10 GX
The 1SG210HN3F43E2VG integrated circuit (IC) chips are part of the Intel Stratix 10 GX FPGA family. These chips offer several advantages and can be applied in various scenarios:1. High-performance computing: The 1SG210HN3F43E2VG chips are designed for high-performance computing applications, such as data centers, cloud computing, and scientific research. They provide high-speed processing capabilities and can handle complex computational tasks efficiently.2. Accelerated data processing: These chips are equipped with advanced features like high-speed transceivers, high-speed memory interfaces, and programmable logic resources. They can accelerate data processing tasks, such as real-time analytics, machine learning, and artificial intelligence.3. Network infrastructure: The 1SG210HN3F43E2VG chips are suitable for network infrastructure applications, including routers, switches, and network security appliances. They offer high-speed connectivity options, low-latency data processing, and programmable logic for customizing network functionalities.4. Wireless communication: These chips can be used in wireless communication systems, such as base stations and wireless access points. They support high-speed data transmission, advanced modulation schemes, and signal processing capabilities, enabling efficient wireless communication.5. Video processing and broadcasting: The 1SG210HN3F43E2VG chips are well-suited for video processing and broadcasting applications. They can handle high-resolution video streams, perform real-time video encoding/decoding, and support video processing algorithms for tasks like video transcoding and video analytics.6. Aerospace and defense: These chips find applications in aerospace and defense systems, such as radar systems, satellite communication, and military-grade equipment. They offer high reliability, low power consumption, and the ability to handle complex signal processing tasks required in these domains.Overall, the 1SG210HN3F43E2VG IC chips provide high-performance computing capabilities, accelerated data processing, and flexibility for customization. They are suitable for a wide range of applications that require high-speed processing, advanced connectivity, and programmable logic resources.
