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1SG110HN2F43E2VG Specifications
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TypeParameter
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Supplier Device Package1760-FBGA (42.5x42.5)
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Package / Case1760-BBGA, FCBGA
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Operating Temperature0°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.77V ~ 0.97V
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Number of I/O688
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Number of Logic Elements/Cells1100000
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Number of LABs/CLBs137500
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesStratix® 10 GX
The 1SG110HN2F43E2VG integrated circuit (IC) chips are part of the Intel Stratix 10 GX FPGA family. These chips offer several advantages and can be applied in various scenarios:1. High-performance computing: The 1SG110HN2F43E2VG chips are designed for high-performance computing applications. They provide high-speed data processing capabilities, making them suitable for tasks that require intensive computational power, such as scientific simulations, data analytics, and machine learning.2. Data center acceleration: These chips can be used to accelerate data center workloads. With their FPGA architecture, they can offload specific tasks from the CPU, improving overall system performance and energy efficiency. They are commonly used in cloud computing environments to accelerate tasks like encryption, compression, and database processing.3. Network acceleration: The 1SG110HN2F43E2VG chips are also well-suited for network acceleration applications. They can be used to implement custom networking protocols, perform packet processing, and handle network security tasks. This makes them valuable in networking equipment like routers, switches, and firewalls.4. Artificial intelligence and deep learning: The high computational power and flexibility of these chips make them ideal for artificial intelligence (AI) and deep learning applications. They can be used to accelerate AI algorithms, neural networks, and training models, enabling faster and more efficient AI processing.5. 5G wireless communication: The 1SG110HN2F43E2VG chips can be applied in 5G wireless communication systems. They can handle the complex signal processing required for 5G networks, including beamforming, modulation, and demodulation. These chips enable faster and more reliable wireless communication, supporting the increasing demands of 5G technology.Overall, the advantages of the 1SG110HN2F43E2VG chips include high-performance computing capabilities, flexibility for custom applications, energy efficiency, and acceleration of various workloads. Their application scenarios range from data centers and network acceleration to AI, deep learning, and 5G wireless communication.