XC7K410T-1FBG676C

XC7K410T-1FBG676C

Manufacturer No:

XC7K410T-1FBG676C

Manufacturer:

AMD

Description:

IC FPGA 400 I/O 676FCBGA

Datasheet:

Datasheet

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XC7K410T-1FBG676C Specifications

  • Type
    Parameter
  • Supplier Device Package
    676-FCBGA (27x27)
  • Package / Case
    676-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    400
  • Total RAM Bits
    29306880
  • Number of Logic Elements/Cells
    406720
  • Number of LABs/CLBs
    31775
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Kintex®-7
The XC7K410T-1FBG676C is a specific model of the Xilinx Kintex-7 family of field-programmable gate array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The Kintex-7 family is known for its high-performance capabilities, making it suitable for demanding applications that require fast processing and high-speed data transfer. 2. Large capacity: The XC7K410T-1FBG676C chip has a large logic capacity, allowing for the implementation of complex designs and algorithms. 3. Low power consumption: Despite its high performance, the Kintex-7 family is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 4. Versatility: The chip supports a wide range of I/O standards, making it compatible with various interfaces and protocols. 5. Flexibility: Being an FPGA, the chip offers the advantage of reprogrammability, allowing for design changes and updates without the need for hardware modifications.Application scenarios: 1. Communications: The high-performance and low-latency capabilities of the XC7K410T-1FBG676C make it suitable for applications in telecommunications, networking, and wireless communication systems. 2. Aerospace and defense: The chip's high-performance computing capabilities and reliability make it suitable for applications in aerospace and defense systems, such as radar processing, signal intelligence, and secure communications. 3. High-performance computing: The large logic capacity and high-speed data processing capabilities of the chip make it suitable for applications in scientific research, data centers, and supercomputing. 4. Industrial automation: The chip can be used in industrial automation systems for tasks such as real-time control, image processing, and machine vision. 5. Medical imaging: The high-performance computing capabilities of the chip make it suitable for medical imaging applications, such as ultrasound, MRI, and CT scanners.These are just a few examples of the advantages and application scenarios of the XC7K410T-1FBG676C chip. The versatility and performance of the chip make it suitable for a wide range of applications in various industries.