5SGXEA3H2F35I3G

5SGXEA3H2F35I3G

Manufacturer No:

5SGXEA3H2F35I3G

Manufacturer:

Intel

Description:

IC FPGA 432 I/O 1152FBGA

Datasheet:

Datasheet

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5SGXEA3H2F35I3G Specifications

  • Type
    Parameter
  • Supplier Device Package
    1152-FBGA (35x35)
  • Package / Case
    1152-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.82V ~ 0.88V
  • Number of I/O
    432
  • Total RAM Bits
    19456000
  • Number of Logic Elements/Cells
    340000
  • Number of LABs/CLBs
    128300
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Stratix® V GX
The 5SGXEA3H2F35I3G is an integrated circuit chip from Intel's Stratix V family of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The 5SGXEA3H2F35I3G chip offers high-performance capabilities with a maximum operating frequency of up to 1.5 GHz. It provides fast processing and efficient execution of complex algorithms. 2. Large Logic Capacity: This chip has a large logic capacity, with around 358,000 logic elements (LEs) and 11.5 million bits of embedded memory. It allows for the implementation of complex digital designs and enables the integration of multiple functions on a single chip. 3. High-Speed Interfaces: The chip supports various high-speed interfaces, including PCIe Gen3, DDR3, and Gigabit Ethernet. It enables seamless connectivity with other devices and systems, facilitating data transfer at high speeds. 4. Low Power Consumption: Despite its high performance, the 5SGXEA3H2F35I3G chip is designed to be power-efficient. It incorporates power-saving features and optimization techniques to minimize power consumption, making it suitable for applications with strict power constraints.Application Scenarios: 1. Communications and Networking: The high-performance and connectivity features of this chip make it suitable for applications in the communications and networking domain. It can be used in routers, switches, network interface cards, and other networking equipment to handle high-speed data processing and routing tasks. 2. High-Performance Computing: The large logic capacity and high-speed interfaces of the chip make it well-suited for high-performance computing applications. It can be used in areas such as scientific research, data centers, and supercomputing to accelerate complex computations and data processing tasks. 3. Video and Image Processing: The chip's high-performance capabilities and embedded memory make it ideal for video and image processing applications. It can be used in video surveillance systems, image recognition, video transcoding, and other multimedia processing tasks. 4. Industrial Automation: The 5SGXEA3H2F35I3G chip can be employed in industrial automation systems, such as programmable logic controllers (PLCs) and industrial control systems. Its high-performance processing and connectivity features enable real-time control and monitoring of industrial processes. 5. Aerospace and Defense: The chip's high-performance computing capabilities and low power consumption make it suitable for aerospace and defense applications. It can be used in radar systems, avionics, signal processing, and other defense-related tasks.These are just a few examples of the advantages and application scenarios of the 5SGXEA3H2F35I3G integrated circuit chip. Its versatility and high-performance features make it applicable in various domains where complex digital processing and connectivity are required.