5SGXMA3H3F35I3LG

5SGXMA3H3F35I3LG

Manufacturer No:

5SGXMA3H3F35I3LG

Manufacturer:

Intel

Description:

IC FPGA 600 I/O 1152FBGA

Datasheet:

Datasheet

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5SGXMA3H3F35I3LG Specifications

  • Type
    Parameter
  • Supplier Device Package
    1152-FBGA (35x35)
  • Package / Case
    1152-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.82V ~ 0.88V
  • Number of I/O
    600
  • Total RAM Bits
    19456000
  • Number of Logic Elements/Cells
    340000
  • Number of LABs/CLBs
    128300
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Stratix® V GX
The 5SGXMA3H3F35I3LG is an integrated circuit chip from Intel's Stratix V family of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The 5SGXMA3H3F35I3LG chip offers high-performance capabilities with a maximum operating frequency of up to 1.5 GHz. It provides a large number of logic elements, DSP blocks, and memory resources, enabling complex and computationally intensive applications.2. Flexibility: Being an FPGA, the chip offers reprogrammability, allowing users to modify the chip's functionality even after deployment. This flexibility makes it suitable for applications where requirements may change over time or where customization is necessary.3. Integration: The chip integrates various components like high-speed transceivers, memory controllers, and embedded processors, reducing the need for external components and simplifying system design.4. Low Power Consumption: The 5SGXMA3H3F35I3LG chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern.Application Scenarios: 1. High-Performance Computing: The chip's high-performance capabilities make it suitable for applications like data centers, scientific computing, and financial modeling, where massive parallel processing and high-speed data processing are required.2. Communications and Networking: With its integrated transceivers and high-speed I/O capabilities, the chip can be used in applications like network switches, routers, and wireless base stations, enabling high-bandwidth data transmission and processing.3. Video and Image Processing: The chip's DSP blocks and high-speed interfaces make it suitable for video and image processing applications, such as video surveillance, medical imaging, and real-time video encoding/decoding.4. Industrial Automation: The chip's flexibility and integration make it suitable for industrial automation applications, including robotics, machine vision, and control systems, where real-time processing, customization, and connectivity are crucial.5. Aerospace and Defense: The chip's high-performance capabilities, reprogrammability, and integration make it suitable for aerospace and defense applications, such as radar systems, avionics, and secure communication systems.It's important to note that the specific application scenarios may vary based on the system requirements and the designer's implementation choices.