1SG110HN3F43E3VG

1SG110HN3F43E3VG

Manufacturer No:

1SG110HN3F43E3VG

Manufacturer:

Intel

Description:

IC FPGA 688 I/O 1760FBGA

Datasheet:

Datasheet

Delivery:

Payment:

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1SG110HN3F43E3VG Specifications

  • Type
    Parameter
  • Supplier Device Package
    1760-FBGA (42.5x42.5)
  • Package / Case
    1760-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.77V ~ 0.97V
  • Number of I/O
    688
  • Number of Logic Elements/Cells
    1100000
  • Number of LABs/CLBs
    137500
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Stratix® 10 GX
The 1SG110HN3F43E3VG integrated circuit (IC) chips are part of the Intel Stratix 10 GX FPGA family. These chips offer several advantages and can be applied in various scenarios:1. High-performance computing: The 1SG110HN3F43E3VG chips are designed for high-performance computing applications, such as data centers, cloud computing, and scientific research. They provide high-speed processing capabilities and can handle complex computational tasks efficiently.2. Accelerated data processing: These chips are equipped with advanced features like high-speed transceivers, high-speed memory interfaces, and programmable logic resources. They can accelerate data processing tasks, such as real-time analytics, machine learning, and artificial intelligence.3. Network infrastructure: The 1SG110HN3F43E3VG chips are suitable for network infrastructure applications, including routers, switches, and network security appliances. They offer high-speed connectivity options, low-latency data processing, and programmable logic for custom network functionality.4. Wireless communication: These chips can be used in wireless communication systems, such as base stations and wireless access points. They support high-speed data transmission, advanced modulation schemes, and signal processing capabilities required for wireless communication protocols like 5G.5. Video processing and broadcasting: The 1SG110HN3F43E3VG chips can handle video processing tasks, such as video encoding, decoding, and transcoding. They offer high-performance video processing capabilities, enabling applications like video streaming, broadcasting, and video conferencing.6. Industrial automation: These chips are suitable for industrial automation applications, such as robotics, control systems, and factory automation. They provide high-speed I/O interfaces, real-time processing capabilities, and programmable logic for custom control algorithms.7. Automotive electronics: The 1SG110HN3F43E3VG chips can be used in automotive electronics, including advanced driver-assistance systems (ADAS), infotainment systems, and autonomous driving. They offer high-performance computing, low-latency communication, and programmable logic for automotive applications.Overall, the 1SG110HN3F43E3VG integrated circuit chips provide high-performance computing capabilities, advanced connectivity options, and programmable logic resources. They can be applied in various scenarios that require high-speed data processing, real-time analytics, network infrastructure, wireless communication, video processing, industrial automation, and automotive electronics.