5SGXMA3H2F35C3G

5SGXMA3H2F35C3G

Manufacturer No:

5SGXMA3H2F35C3G

Manufacturer:

Intel

Description:

IC FPGA 600 I/O 1152FBGA

Datasheet:

Datasheet

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5SGXMA3H2F35C3G Specifications

  • Type
    Parameter
  • Supplier Device Package
    1152-FBGA (35x35)
  • Package / Case
    1152-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.82V ~ 0.88V
  • Number of I/O
    600
  • Total RAM Bits
    19456000
  • Number of Logic Elements/Cells
    340000
  • Number of LABs/CLBs
    128300
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Stratix® V GX
The 5SGXMA3H2F35C3G is an integrated circuit chip from Intel's Stratix V family of field-programmable gate arrays (FPGAs). It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the 5SGXMA3H2F35C3G chip are:Advantages: 1. High Performance: The 5SGXMA3H2F35C3G chip provides high-performance capabilities, making it suitable for demanding applications that require fast processing speeds and low latency. 2. Flexibility: Being an FPGA, the chip offers flexibility in terms of reconfigurability. It allows users to modify the chip's functionality even after deployment, enabling customization and adaptability to changing requirements. 3. Integration: The chip integrates various components, including programmable logic, high-speed transceivers, memory, and digital signal processing (DSP) blocks, providing a comprehensive solution in a single device. 4. Power Efficiency: The 5SGXMA3H2F35C3G chip is designed to be power-efficient, enabling energy-saving operation and reducing overall power consumption. 5. High-Speed Connectivity: With its high-speed transceivers, the chip supports various communication protocols, such as PCIe, Ethernet, and USB, facilitating connectivity with external devices.Application Scenarios: 1. Data Centers: The high-performance capabilities of the 5SGXMA3H2F35C3G chip make it suitable for data center applications, such as network acceleration, data processing, and encryption/decryption tasks. 2. High-Frequency Trading: The chip's low latency and high-speed connectivity make it ideal for high-frequency trading systems, where quick decision-making and fast data processing are crucial. 3. Aerospace and Defense: The flexibility and integration of the chip allow it to be used in aerospace and defense applications, such as radar systems, communication systems, and signal processing tasks. 4. Video Processing: The 5SGXMA3H2F35C3G chip's high-performance capabilities and DSP blocks make it suitable for video processing applications, including video encoding, decoding, and real-time video analytics. 5. Industrial Automation: The chip's power efficiency and flexibility make it applicable in industrial automation scenarios, such as robotics, machine vision, and control systems.These are just a few examples of the advantages and application scenarios of the 5SGXMA3H2F35C3G chip. Its versatility and performance make it suitable for a wide range of applications in various industries.