5SGSMD3H3F35I3G

5SGSMD3H3F35I3G

Manufacturer No:

5SGSMD3H3F35I3G

Manufacturer:

Intel

Description:

IC FPGA 432 I/O 1152FBGA

Datasheet:

Datasheet

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5SGSMD3H3F35I3G Specifications

  • Type
    Parameter
  • Supplier Device Package
    1152-FBGA (35x35)
  • Package / Case
    1152-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.82V ~ 0.88V
  • Number of I/O
    432
  • Total RAM Bits
    13312000
  • Number of Logic Elements/Cells
    236000
  • Number of LABs/CLBs
    89000
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Stratix® V GS
The 5SGSMD3H3F35I3G is a specific model of integrated circuit (IC) chip from Intel's Stratix V series. It is a high-performance FPGA (Field-Programmable Gate Array) chip that offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the 5SGSMD3H3F35I3G IC chip are:Advantages: 1. High Performance: The 5SGSMD3H3F35I3G chip provides high-speed processing capabilities, making it suitable for applications that require complex computations and real-time data processing. 2. Flexibility: Being an FPGA chip, it offers the advantage of reprogrammability. Users can configure the chip's logic and functionality according to their specific requirements, allowing for customization and adaptability. 3. Integration: The chip integrates various components, including programmable logic, high-speed transceivers, memory blocks, and digital signal processing (DSP) blocks, providing a comprehensive solution for complex system designs. 4. Low Power Consumption: The 5SGSMD3H3F35I3G chip is designed to be power-efficient, making it suitable for applications where energy consumption is a concern. 5. High-Speed Connectivity: The chip features high-speed transceivers that support various communication protocols, enabling connectivity with other devices and systems.Application Scenarios: 1. Communications and Networking: The high-performance and connectivity features of the 5SGSMD3H3F35I3G chip make it suitable for applications in telecommunications, networking, and data centers. It can be used for tasks such as packet processing, encryption/decryption, and protocol conversion. 2. High-Performance Computing: The chip's processing capabilities and reprogrammability make it suitable for applications in scientific research, simulations, and data analysis, where high-performance computing is required. 3. Video and Image Processing: The 5SGSMD3H3F35I3G chip can be used in applications that involve video and image processing, such as video encoding/decoding, image recognition, and computer vision. 4. Industrial Automation: The chip's flexibility and integration make it suitable for industrial automation applications, including control systems, robotics, and machine vision. 5. Aerospace and Defense: The high-performance and reliability of the 5SGSMD3H3F35I3G chip make it suitable for aerospace and defense applications, such as radar systems, avionics, and secure communications.These are just a few examples of the advantages and application scenarios of the 5SGSMD3H3F35I3G IC chip. The specific usage will depend on the requirements and design considerations of the target application.