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EP3SE50F780C3G Specifications
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TypeParameter
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Supplier Device Package780-FBGA (29x29)
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Package / Case780-BBGA, FCBGA
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Operating Temperature0°C ~ 85°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.86V ~ 1.15V
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Number of I/O488
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Total RAM Bits5760000
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Number of Logic Elements/Cells47500
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Number of LABs/CLBs1900
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesStratix® III E
The EP3SE50F780C3G is an integrated circuit chip from the Stratix III FPGA family, manufactured by Intel (formerly Altera). It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the EP3SE50F780C3G chip are:Advantages: 1. High-performance FPGA: The EP3SE50F780C3G chip is a high-performance field-programmable gate array (FPGA) that offers a large number of logic elements, high-speed transceivers, and embedded memory blocks. This makes it suitable for applications that require complex digital logic processing and high-speed data communication.2. Low power consumption: The chip is designed to be power-efficient, allowing it to be used in applications where power consumption is a critical factor. It offers power-saving features like programmable power management and clock gating, enabling efficient utilization of resources.3. High-speed data processing: With its high-speed transceivers and advanced DSP blocks, the EP3SE50F780C3G chip can handle high-speed data processing tasks. It is suitable for applications that require real-time data processing, such as high-frequency trading, video processing, and telecommunications.4. Flexible configuration options: The chip supports partial reconfiguration, allowing specific sections of the FPGA to be reprogrammed while the rest of the design remains operational. This flexibility is beneficial in applications where dynamic reconfiguration is required, such as software-defined radios and adaptive signal processing.Application Scenarios: 1. Communications and networking: The EP3SE50F780C3G chip can be used in networking equipment, routers, switches, and other communication devices. Its high-speed transceivers and processing capabilities enable efficient data routing, packet processing, and protocol handling.2. High-performance computing: The chip's large number of logic elements and embedded memory blocks make it suitable for high-performance computing applications. It can be used in areas like scientific research, data centers, and supercomputing, where massive parallel processing and high-speed data transfer are required.3. Industrial automation: The EP3SE50F780C3G chip can be utilized in industrial automation systems, including robotics, machine vision, and control systems. Its ability to handle complex logic and real-time data processing enables precise control and monitoring of industrial processes.4. Aerospace and defense: The chip's high-performance capabilities and low power consumption make it suitable for aerospace and defense applications. It can be used in radar systems, avionics, satellite communication, and military-grade equipment, where reliability, speed, and power efficiency are crucial.5. Medical devices: The EP3SE50F780C3G chip can be employed in medical devices like imaging systems, patient monitoring equipment, and diagnostic instruments. Its processing power and flexibility allow for real-time image processing, data analysis, and signal filtering in medical applications.Overall, the EP3SE50F780C3G chip offers high-performance, low power consumption, and flexibility, making it suitable for a wide range of applications that require complex digital processing, high-speed data communication, and power efficiency.