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XCV400E-6BG560C0773 Specifications
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TypeParameter
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Number of LABs/CLBs2400
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Supplier Device Package560-MBGA (42.5x42.5)
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Package / Case560-LBGA Exposed Pad, Metal
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Operating Temperature0°C ~ 85°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply1.71V ~ 1.89V
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Number of Gates569952
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Number of I/O404
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Total RAM Bits163840
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Number of Logic Elements/Cells10800
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PackagingBulk
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Product StatusActive
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SeriesVirtex®-E
The XCV400E-6BG560C0773 is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Virtex-II Pro family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The XCV400E-6BG560C0773 chip offers high-speed processing capabilities, making it suitable for applications that require real-time data processing and high-performance computing. 2. Flexibility: Being an FPGA, it allows for reprogramming and reconfiguring the chip's functionality even after it has been manufactured. This flexibility enables customization and adaptability to changing requirements. 3. Integration: The chip integrates various components like configurable logic blocks, embedded processors, memory, and input/output interfaces, allowing for complex system integration on a single chip. 4. Power Efficiency: The XCV400E-6BG560C0773 chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 5. Scalability: The Virtex-II Pro family offers different models with varying capacities, allowing for scalability based on the complexity of the application.Application Scenarios: 1. Digital Signal Processing (DSP): The high-performance capabilities of the XCV400E-6BG560C0773 chip make it suitable for DSP applications like image and video processing, audio processing, and telecommunications. 2. Aerospace and Defense: The chip's flexibility and integration make it suitable for applications in aerospace and defense, such as radar systems, avionics, and secure communication systems. 3. Industrial Automation: The XCV400E-6BG560C0773 chip can be used in industrial automation applications like robotics, machine vision, and control systems, where real-time processing and customization are required. 4. High-Performance Computing: The chip's high-speed processing capabilities make it suitable for applications in scientific research, data centers, and supercomputing, where massive computational power is needed. 5. Communications: The XCV400E-6BG560C0773 chip can be used in communication systems like network routers, switches, and wireless base stations, where high-speed data processing and low-latency communication are essential.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project.
