XC7K325T-2FBG676C

XC7K325T-2FBG676C

Manufacturer No:

XC7K325T-2FBG676C

Manufacturer:

AMD

Description:

IC FPGA 400 I/O 676FCBGA

Datasheet:

Datasheet

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XC7K325T-2FBG676C Specifications

  • Type
    Parameter
  • Number of Logic Elements/Cells
    326080
  • Number of LABs/CLBs
    25475
  • Supplier Device Package
    676-FCBGA (27x27)
  • Package / Case
    676-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    400
  • Total RAM Bits
    16404480
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Kintex®-7
The XC7K325T-2FBG676C is a specific model of the Xilinx Kintex-7 family of field-programmable gate array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The Kintex-7 family offers high-performance FPGA capabilities, making it suitable for applications that require complex digital logic processing, high-speed data processing, and real-time processing.2. Large logic capacity: The XC7K325T-2FBG676C chip has a large logic capacity, allowing for the implementation of complex designs and algorithms.3. High-speed interfaces: It supports high-speed serial interfaces like PCIe, Gigabit Ethernet, and USB 3.0, enabling fast data transfer rates and communication with external devices.4. Low power consumption: The Kintex-7 family is designed to be power-efficient, making it suitable for applications where power consumption is a concern.5. Flexibility and reconfigurability: FPGAs can be reprogrammed to implement different functionalities, making them suitable for applications that require flexibility and adaptability.Application scenarios: 1. Communications and networking: The high-performance and high-speed interfaces of the XC7K325T-2FBG676C make it suitable for applications in telecommunications, networking, and data centers. It can be used for tasks like packet processing, protocol conversion, and network acceleration.2. Aerospace and defense: The XC7K325T-2FBG676C can be used in aerospace and defense applications that require high-performance signal processing, radar systems, image and video processing, and encryption/decryption.3. Industrial automation: It can be used in industrial automation applications for tasks like motor control, machine vision, robotics, and real-time control systems.4. Medical imaging: The high-performance capabilities of the XC7K325T-2FBG676C make it suitable for medical imaging applications like ultrasound, MRI, and CT scanners, where real-time processing and high-speed data transfer are crucial.5. Scientific research: The chip can be used in scientific research applications that require high-performance computing, data analysis, and simulation.These are just a few examples, and the XC7K325T-2FBG676C can be used in various other domains where high-performance, flexibility, and low power consumption are required.