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XC3S1400A-4FGG484C Specifications
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TypeParameter
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Number of Logic Elements/Cells25344
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Number of LABs/CLBs2816
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Supplier Device Package484-FBGA (23x23)
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Package / Case484-BBGA
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Operating Temperature0°C ~ 85°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply1.14V ~ 1.26V
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Number of Gates1400000
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Number of I/O375
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Total RAM Bits589824
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesSpartan®-3A
The XC3S1400A-4FGG484C is a specific model of the Xilinx Spartan-3A FPGA (Field-Programmable Gate Array) family. Here are some advantages and application scenarios of this integrated circuit chip:Advantages: 1. High-performance FPGA: The Spartan-3A family offers a balance between cost, power consumption, and performance. The XC3S1400A-4FGG484C chip provides a high-performance FPGA solution suitable for various applications. 2. Large logic capacity: With 1,408 slices and 86,016 logic cells, this chip offers a significant amount of logic capacity, allowing for complex digital designs. 3. Flexible I/O options: The XC3S1400A-4FGG484C chip provides a wide range of I/O options, including LVCMOS, LVTTL, LVDS, and differential signaling, making it versatile for different interface requirements. 4. Low power consumption: The Spartan-3A family is designed to be power-efficient, making it suitable for battery-powered or low-power applications. 5. On-chip memory: The chip includes various on-chip memory resources, such as block RAM and distributed RAM, which can be utilized for data storage and processing.Application Scenarios: 1. Communications: The XC3S1400A-4FGG484C chip can be used in communication systems for tasks like protocol conversion, data encoding/decoding, and signal processing. 2. Industrial automation: It can be employed in industrial control systems, programmable logic controllers (PLCs), and robotics for real-time control, monitoring, and data processing. 3. Video and image processing: The high logic capacity and on-chip memory make it suitable for video and image processing applications, such as video compression, image recognition, and computer vision. 4. Test and measurement equipment: The chip can be used in test and measurement devices for signal generation, data acquisition, and signal analysis. 5. Embedded systems: The XC3S1400A-4FGG484C can be integrated into embedded systems for various applications, including automotive, aerospace, medical devices, and consumer electronics.It's important to note that the specific application scenarios may vary depending on the system requirements and the designer's implementation choices.
