XC3S200AN-5FTG256C

XC3S200AN-5FTG256C

Manufacturer No:

XC3S200AN-5FTG256C

Manufacturer:

AMD

Description:

IC FPGA 195 I/O 256FTBGA

Datasheet:

Datasheet

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XC3S200AN-5FTG256C Specifications

  • Type
    Parameter
  • Number of Logic Elements/Cells
    4032
  • Number of LABs/CLBs
    448
  • Supplier Device Package
    256-FTBGA (17x17)
  • Package / Case
    256-LBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of Gates
    200000
  • Number of I/O
    195
  • Total RAM Bits
    294912
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Spartan®-3AN
The XC3S200AN-5FTG256C is a specific model of integrated circuit (IC) chip from Xilinx, which belongs to the Spartan-3AN family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The Spartan-3AN family offers a balance between cost, power consumption, and performance. The XC3S200AN-5FTG256C chip provides a good combination of logic resources, I/O capabilities, and memory options. 2. Low power consumption: The Spartan-3AN FPGAs are designed to be power-efficient, making them suitable for applications where power consumption is a concern. 3. Flexible and reprogrammable: FPGAs can be reprogrammed to implement different functionalities, making them highly flexible for various applications. 4. Large number of I/O pins: The XC3S200AN-5FTG256C chip has 200 general-purpose I/O pins, allowing for connectivity with external devices and peripherals. 5. On-chip memory: The Spartan-3AN FPGAs have built-in Block RAM (BRAM) resources, which can be used for data storage or as FIFO buffers.Application scenarios: 1. Industrial control systems: The XC3S200AN-5FTG256C chip can be used in industrial automation, process control, and monitoring systems. Its flexibility allows for customization and adaptation to specific requirements. 2. Communication systems: FPGAs are commonly used in communication applications such as wireless base stations, network routers, and switches. The XC3S200AN-5FTG256C chip's I/O capabilities make it suitable for interfacing with different communication protocols. 3. Medical devices: FPGAs find applications in medical equipment like ultrasound machines, patient monitoring systems, and medical imaging devices. The XC3S200AN-5FTG256C chip's low power consumption and reprogrammability make it suitable for such devices. 4. Automotive electronics: FPGAs are used in automotive applications like infotainment systems, advanced driver-assistance systems (ADAS), and engine control units (ECUs). The XC3S200AN-5FTG256C chip's performance and I/O capabilities make it suitable for these applications. 5. Test and measurement equipment: FPGAs are widely used in test and measurement devices due to their flexibility and ability to handle complex signal processing. The XC3S200AN-5FTG256C chip's on-chip memory and I/O pins make it suitable for such applications.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of a particular project.