XC7K70T-1FBG676I

XC7K70T-1FBG676I

Manufacturer No:

XC7K70T-1FBG676I

Manufacturer:

AMD

Description:

IC FPGA 300 I/O 676FCBGA

Datasheet:

Datasheet

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XC7K70T-1FBG676I Specifications

  • Type
    Parameter
  • Supplier Device Package
    676-FCBGA (27x27)
  • Package / Case
    676-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    300
  • Total RAM Bits
    4976640
  • Number of Logic Elements/Cells
    65600
  • Number of LABs/CLBs
    5125
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Kintex®-7
The XC7K70T-1FBG676I is a specific model of integrated circuit (IC) chip from the Xilinx Kintex-7 family. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The XC7K70T-1FBG676I is a field-programmable gate array (FPGA) chip, which offers high-performance computing capabilities. It can be reprogrammed to implement complex digital logic circuits, making it versatile for various applications. 2. Large logic capacity: This chip has a large logic capacity, allowing for the implementation of complex designs. It contains a significant number of configurable logic blocks (CLBs), digital signal processing (DSP) slices, and memory blocks. 3. High-speed interfaces: The XC7K70T-1FBG676I supports various high-speed interfaces, such as PCIe, Gigabit Ethernet, and DDR3 memory interfaces. This makes it suitable for applications requiring fast data transfer and communication. 4. Low power consumption: Despite its high-performance capabilities, the chip is designed to consume low power, making it energy-efficient for many applications. 5. Advanced features: The XC7K70T-1FBG676I incorporates advanced features like dynamic power management, clock management, and built-in self-test (BIST) capabilities, enhancing its functionality and ease of use.Application scenarios: 1. Communications and networking: The high-speed interfaces and large logic capacity of the XC7K70T-1FBG676I make it suitable for applications in telecommunications, networking, and data centers. It can be used for implementing high-speed data processing, packet routing, encryption/decryption, and protocol conversion. 2. Industrial automation: The chip's reprogrammable nature and high-performance computing capabilities make it ideal for industrial automation applications. It can be used for implementing control systems, real-time monitoring, and data acquisition in manufacturing plants, robotics, and process automation. 3. Aerospace and defense: The XC7K70T-1FBG676I can be used in aerospace and defense applications, such as radar systems, avionics, and secure communication systems. Its high-speed interfaces, large logic capacity, and low power consumption are advantageous in these demanding environments. 4. Medical imaging: The chip's ability to process large amounts of data and support high-speed interfaces makes it suitable for medical imaging applications. It can be used for implementing image processing algorithms, real-time image reconstruction, and analysis in medical imaging devices like CT scanners and ultrasound machines. 5. High-performance computing: The XC7K70T-1FBG676I can be utilized in high-performance computing applications, such as scientific research, data analytics, and simulations. Its large logic capacity and high-speed interfaces enable accelerated processing and efficient data handling.These are just a few examples of the advantages and application scenarios of the XC7K70T-1FBG676I chip. Its versatility and capabilities make it suitable for a wide range of applications requiring high-performance computing and programmable logic.