XC3S1400AN-5FGG676C

XC3S1400AN-5FGG676C

Manufacturer No:

XC3S1400AN-5FGG676C

Manufacturer:

AMD

Description:

IC FPGA 502 I/O 676FBGA

Datasheet:

Datasheet

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XC3S1400AN-5FGG676C Specifications

  • Type
    Parameter
  • Number of Gates
    1400000
  • Supplier Device Package
    676-FBGA (27x27)
  • Package / Case
    676-BGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    502
  • Total RAM Bits
    589824
  • Number of Logic Elements/Cells
    25344
  • Number of LABs/CLBs
    2816
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Spartan®-3AN
The XC3S1400AN-5FGG676C is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Spartan-3AN family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Logic Density: The XC3S1400AN-5FGG676C offers a high logic density, allowing for the implementation of complex digital designs. 2. Flexible and Reconfigurable: Being an FPGA, it is highly flexible and can be reprogrammed to perform different functions or adapt to changing requirements. 3. Low Power Consumption: The Spartan-3AN family is known for its low power consumption, making it suitable for power-sensitive applications. 4. Integrated Features: The chip includes various integrated features like built-in multipliers, block RAM, and DSP slices, which can be utilized to enhance the functionality of the design. 5. Cost-Effective: FPGAs provide a cost-effective solution compared to custom ASICs (Application-Specific Integrated Circuits) as they can be programmed and reprogrammed as needed.Application Scenarios: 1. Communications: The XC3S1400AN-5FGG676C can be used in communication systems for tasks like protocol conversion, data encryption/decryption, and signal processing. 2. Industrial Control: It can be employed in industrial control systems for tasks like motor control, sensor interfacing, and process monitoring. 3. Video and Image Processing: The chip's integrated features like DSP slices make it suitable for video and image processing applications, such as video compression, image recognition, and real-time video streaming. 4. Automotive Electronics: The XC3S1400AN-5FGG676C can be utilized in automotive electronics for tasks like engine control, driver assistance systems, and infotainment systems. 5. Medical Devices: It can be used in medical devices for tasks like patient monitoring, medical imaging, and diagnostic equipment.These are just a few examples, and the XC3S1400AN-5FGG676C can be applied in various other domains where programmable logic and high-performance processing are required.