XC3S700AN-4FGG484C

XC3S700AN-4FGG484C

Manufacturer No:

XC3S700AN-4FGG484C

Manufacturer:

AMD

Description:

IC FPGA 372 I/O 484FBGA

Datasheet:

Datasheet

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XC3S700AN-4FGG484C Specifications

  • Type
    Parameter
  • Number of Gates
    700000
  • Supplier Device Package
    484-FBGA (23x23)
  • Package / Case
    484-BBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    372
  • Total RAM Bits
    368640
  • Number of Logic Elements/Cells
    13248
  • Number of LABs/CLBs
    1472
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Spartan®-3AN
The XC3S700AN-4FGG484C is a specific model of the Xilinx Spartan-3AN family of Field-Programmable Gate Array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The Spartan-3AN family offers a balance between cost, power consumption, and performance. The XC3S700AN-4FGG484C chip provides a large number of logic cells, I/O pins, and memory blocks, making it suitable for complex digital designs. 2. Low power consumption: The Spartan-3AN family is designed to be power-efficient, making it suitable for battery-powered or low-power applications. 3. Embedded non-volatile configuration memory: The chip includes non-volatile configuration memory, which means that the FPGA configuration can be stored even when the power is turned off. This feature eliminates the need for external configuration devices, simplifying the design and reducing costs. 4. Integrated features: The Spartan-3AN family includes various integrated features like Digital Clock Managers (DCMs), Phase-Locked Loops (PLLs), and SelectIO technology, which enhance the chip's functionality and flexibility.Application scenarios: 1. Industrial control systems: The XC3S700AN-4FGG484C chip can be used in industrial control systems to implement complex control algorithms, interface with various sensors and actuators, and provide real-time processing capabilities. 2. Communications systems: The chip's high-performance and low power consumption make it suitable for applications in wireless communication systems, such as base stations, wireless routers, or software-defined radios. 3. Video and image processing: The XC3S700AN-4FGG484C chip can be utilized in video and image processing applications, such as video encoding/decoding, image recognition, or real-time video processing. 4. Automotive electronics: The chip's robustness and reliability make it suitable for automotive applications, such as engine control units, advanced driver-assistance systems (ADAS), or infotainment systems. 5. Aerospace and defense: The XC3S700AN-4FGG484C chip can be used in aerospace and defense applications, such as radar systems, avionics, or secure communication systems, where high-performance, reliability, and security are crucial.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of a particular project.