XC3S400-4FTG256I

XC3S400-4FTG256I

Manufacturer No:

XC3S400-4FTG256I

Manufacturer:

AMD

Description:

IC FPGA 173 I/O 256FTBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

XC3S400-4FTG256I Specifications

  • Type
    Parameter
  • Number of Gates
    400000
  • Number of LABs/CLBs
    896
  • Supplier Device Package
    256-FTBGA (17x17)
  • Package / Case
    256-LBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    173
  • Total RAM Bits
    294912
  • Number of Logic Elements/Cells
    8064
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Spartan®-3
The XC3S400-4FTG256I is a specific model of the Xilinx Spartan-3 FPGA (Field-Programmable Gate Array) family. Here are some advantages and application scenarios of this integrated circuit chip:Advantages: 1. High-performance FPGA: The Spartan-3 family offers a balance between cost, power consumption, and performance. The XC3S400-4FTG256I chip provides a good combination of logic resources, I/O capabilities, and performance for various applications. 2. Flexibility: Being an FPGA, the XC3S400-4FTG256I chip allows for reprogramming and reconfiguring the logic circuits within the chip. This flexibility enables rapid prototyping, design iteration, and customization. 3. Low power consumption: The Spartan-3 family is designed to be power-efficient, making it suitable for battery-powered or low-power applications. 4. Large number of I/O pins: The XC3S400-4FTG256I chip has 256 I/O pins, which allows for interfacing with a wide range of external devices and peripherals. 5. Cost-effective: The Spartan-3 family, including the XC3S400-4FTG256I chip, offers a good balance between cost and performance, making it an economical choice for many applications.Application scenarios: 1. Embedded systems: The XC3S400-4FTG256I chip can be used in various embedded systems, such as industrial control systems, automotive electronics, and consumer electronics. Its flexibility allows for implementing custom logic and interfaces tailored to specific requirements. 2. Communications: The chip can be used in networking equipment, routers, switches, and other communication devices. Its high-performance capabilities enable efficient data processing and protocol handling. 3. Signal processing: The XC3S400-4FTG256I chip can be utilized in applications that require real-time signal processing, such as digital signal processing (DSP), image and video processing, and audio processing. 4. Test and measurement: The chip's reprogrammability and large number of I/O pins make it suitable for test and measurement equipment, where it can be used for signal generation, data acquisition, and control. 5. Prototyping and development: The XC3S400-4FTG256I chip is commonly used in prototyping and development boards for educational purposes, research projects, and proof-of-concept designs.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and context of the project.