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MC9S08DN60MLC

MC9S08DN60MLC

Manufacturer No:

MC9S08DN60MLC

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 60KB FLASH 32LQFP

Datasheet:

Datasheet

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MC9S08DN60MLC Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-LQFP (7x7)
  • Package / Case
    32-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 10x12b
  • Voltage - Supply (Vcc/Vdd)
    2.7V ~ 5.5V
  • RAM Size
    2K x 8
  • EEPROM Size
    2K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    60KB (60K x 8)
  • Number of I/O
    25
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    I²C, LINbus, SCI, SPI
  • Speed
    40MHz
  • Core Size
    8-Bit
  • Core Processor
    S08
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    S08
The MC9S08DN60MLC is a microcontroller integrated circuit chip developed by NXP Semiconductors. It belongs to the S08 family of microcontrollers and offers several advantages and application scenarios. Some of them include:1. Low Power Consumption: The MC9S08DN60MLC is designed to operate at low power, making it suitable for battery-powered devices or applications where power efficiency is crucial.2. High Performance: Despite its low power consumption, the chip offers high-performance capabilities, including a 60 MHz CPU core, flash memory, and a wide range of peripherals.3. Integrated Peripherals: The chip includes various integrated peripherals such as analog-to-digital converters (ADC), timers, serial communication interfaces (UART, SPI, I2C), and general-purpose input/output (GPIO) pins. These peripherals enable the chip to interface with a wide range of sensors, actuators, and other external devices.4. Small Form Factor: The MC9S08DN60MLC comes in a small form factor package, making it suitable for applications with space constraints.5. Cost-Effective Solution: The chip provides a cost-effective solution for applications that require a combination of low power consumption, high performance, and integrated peripherals.Application scenarios where the MC9S08DN60MLC can be utilized include:1. Internet of Things (IoT) Devices: The low power consumption and integrated peripherals make it suitable for IoT devices that require connectivity, sensor interfacing, and efficient power management.2. Consumer Electronics: The chip can be used in various consumer electronics applications such as smart home devices, wearable devices, remote controls, and portable devices.3. Industrial Automation: The MC9S08DN60MLC can be employed in industrial automation applications, including control systems, motor control, and monitoring devices.4. Automotive Electronics: The chip's robustness, low power consumption, and integrated peripherals make it suitable for automotive applications such as engine control units, dashboard displays, and sensor interfaces.5. Medical Devices: The low power consumption and integrated peripherals make the chip suitable for medical devices that require long battery life, sensor interfacing, and data processing capabilities.Overall, the MC9S08DN60MLC offers a combination of low power consumption, high performance, and integrated peripherals, making it suitable for a wide range of applications in various industries.
MC9S08DN60MLC Relevant information