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MC9S08DN60CLC

MC9S08DN60CLC

Manufacturer No:

MC9S08DN60CLC

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 60KB FLASH 32LQFP

Datasheet:

Datasheet

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MC9S08DN60CLC Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-LQFP (7x7)
  • Package / Case
    32-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 10x12b
  • Voltage - Supply (Vcc/Vdd)
    2.7V ~ 5.5V
  • RAM Size
    2K x 8
  • EEPROM Size
    2K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    60KB (60K x 8)
  • Number of I/O
    25
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    I²C, LINbus, SCI, SPI
  • Speed
    40MHz
  • Core Size
    8-Bit
  • Core Processor
    S08
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    S08
The R8A77405PBG#UA is an integrated circuit chip developed by Renesas Electronics Corporation. It is a system-on-chip (SoC) designed for automotive applications. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The R8A77405PBG#UA chip offers high processing power and performance, making it suitable for demanding automotive applications. 2. Integrated Functionality: It integrates various components and functions into a single chip, reducing the need for external components and simplifying the design process. 3. Automotive-Grade Reliability: This chip is designed to meet the stringent requirements of the automotive industry, ensuring high reliability and durability in harsh environments. 4. Low Power Consumption: The R8A77405PBG#UA chip is optimized for low power consumption, making it suitable for automotive applications where energy efficiency is crucial. 5. Connectivity Options: It supports various communication interfaces like Ethernet, CAN, and USB, enabling seamless connectivity with other automotive systems.Application Scenarios: 1. In-Vehicle Infotainment (IVI) Systems: The R8A77405PBG#UA chip can be used in IVI systems to provide multimedia capabilities, including audio/video playback, navigation, connectivity, and user interface. 2. Advanced Driver Assistance Systems (ADAS): This chip can be utilized in ADAS applications to process sensor data, perform real-time object detection, and enable features like lane departure warning, collision avoidance, and adaptive cruise control. 3. Automotive Gateway: The R8A77405PBG#UA chip can act as a gateway between different automotive networks, facilitating communication between various systems within the vehicle, such as body control, powertrain, and chassis control. 4. Telematics: It can be employed in telematics systems to enable vehicle tracking, remote diagnostics, over-the-air updates, and connectivity with external services. 5. Instrument Clusters: The chip can be used in digital instrument clusters, providing high-resolution graphics, customizable displays, and real-time vehicle information.Overall, the R8A77405PBG#UA chip offers high performance, integration, and reliability, making it suitable for a wide range of automotive applications.
MC9S08DN60CLC Relevant information