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MCF52110CVM66

MCF52110CVM66

Manufacturer No:

MCF52110CVM66

Manufacturer:

NXP USA Inc.

Description:

IC MCU 32BIT 128KB FLSH 81MAPBGA

Datasheet:

Datasheet

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MCF52110CVM66 Specifications

  • Type
    Parameter
  • Supplier Device Package
    81-MAPBGA (10x10)
  • Package / Case
    81-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 8x12b
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 3.6V
  • RAM Size
    16K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    128KB (128K x 8)
  • Number of I/O
    56
  • Peripherals
    DMA, LVD, POR, PWM, WDT
  • Connectivity
    I²C, SPI, UART/USART
  • Speed
    66MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    Coldfire V2
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MCF521xx
The UPD70F3370AM2GBA1-GAH-E2-QS-AX integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The UPD70F3370AM2GBA1-GAH-E2-QS-AX chips are designed to deliver high performance with a 32-bit RISC CPU core, capable of executing instructions at high speeds. 2. Low Power Consumption: These chips are optimized for low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Rich Peripherals: The chips come with a wide range of built-in peripherals, including timers, UART, I2C, SPI, ADC, and PWM, providing flexibility for various applications. 4. Ample Memory: The chips have a large memory capacity, including flash memory for program storage and RAM for data storage, enabling the execution of complex algorithms and data processing tasks. 5. Enhanced Security: The chips offer security features like memory protection units and encryption/decryption functions, ensuring the safety of sensitive data.Application Scenarios: 1. Industrial Automation: The UPD70F3370AM2GBA1-GAH-E2-QS-AX chips can be used in industrial automation systems for controlling and monitoring processes, thanks to their high performance, low power consumption, and rich peripheral support. 2. Automotive Electronics: These chips are suitable for automotive applications, such as engine control units (ECUs), body control modules (BCMs), and infotainment systems, due to their robustness, memory capacity, and security features. 3. Consumer Electronics: The chips can be utilized in various consumer electronic devices, including smart home appliances, gaming consoles, and multimedia systems, benefiting from their high performance, low power consumption, and ample memory. 4. Medical Devices: The UPD70F3370AM2GBA1-GAH-E2-QS-AX chips can be employed in medical devices like patient monitoring systems, diagnostic equipment, and medical imaging devices, leveraging their processing power, memory capacity, and security features. 5. Internet of Things (IoT): These chips can be integrated into IoT devices, enabling connectivity, data processing, and control functions, thanks to their low power consumption, rich peripherals, and security features.Overall, the UPD70F3370AM2GBA1-GAH-E2-QS-AX integrated circuit chips offer high performance, low power consumption, rich peripherals, ample memory, and enhanced security, making them suitable for a wide range of applications in various industries.
MCF52110CVM66 Relevant information