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P89CV51RB2FBC,557

P89CV51RB2FBC,557

Manufacturer No:

P89CV51RB2FBC,557

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 16KB FLASH 44TQFP

Datasheet:

Datasheet

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Payment:

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P89CV51RB2FBC,557 Specifications

  • Type
    Parameter
  • Number of I/O
    32
  • Supplier Device Package
    44-TQFP (10x10)
  • Package / Case
    44-TQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    4.5V ~ 5.5V
  • RAM Size
    1K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    16KB (16K x 8)
  • Peripherals
    POR, PWM, WDT
  • Connectivity
    EBI/EMI, SPI, UART/USART
  • Speed
    40MHz
  • Core Size
    8-Bit
  • Core Processor
    8051
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    89C
The MB90497GPFM-G-107-BNDE1 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The chips are based on the 32-bit RISC CPU core, which provides high processing power and performance. 2. Low Power Consumption: The chips are designed to operate at low power, making them suitable for battery-powered devices and energy-efficient applications. 3. Integrated Peripherals: The chips come with various integrated peripherals such as UART, I2C, SPI, timers, and ADC, reducing the need for external components and simplifying the overall system design. 4. Enhanced Security: The chips offer advanced security features like memory protection units, secure boot, and encryption, ensuring the safety of sensitive data and preventing unauthorized access. 5. Wide Operating Temperature Range: The chips can operate in a wide temperature range, making them suitable for industrial applications that require reliable performance in harsh environments.Application Scenarios: 1. Industrial Automation: The chips can be used in industrial automation systems for controlling and monitoring processes, machinery, and equipment. 2. Internet of Things (IoT): The chips are suitable for IoT applications such as smart home devices, wearable devices, and sensor nodes, where low power consumption and high performance are essential. 3. Automotive Electronics: The chips can be used in automotive applications like engine control units, dashboard systems, and infotainment systems, where reliability and high processing power are required. 4. Medical Devices: The chips can be utilized in medical devices such as patient monitoring systems, diagnostic equipment, and portable medical devices, where low power consumption and high performance are crucial. 5. Consumer Electronics: The chips can be used in various consumer electronics products like smart appliances, gaming consoles, and multimedia devices, where high performance and low power consumption are desired.Overall, the MB90497GPFM-G-107-BNDE1 integrated circuit chips offer high performance, low power consumption, and a wide range of applications, making them suitable for various industries and electronic devices.
P89CV51RB2FBC,557 Relevant information