MC9S08QG8MDNE

MC9S08QG8MDNE

Manufacturer No:

MC9S08QG8MDNE

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 8KB FLASH 8SOIC

Datasheet:

Datasheet

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MC9S08QG8MDNE Specifications

  • Type
    Parameter
  • Number of I/O
    4
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 4x10b
  • Voltage - Supply (Vcc/Vdd)
    1.8V ~ 3.6V
  • RAM Size
    512 x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    8KB (8K x 8)
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    I²C, SCI, SPI
  • Speed
    20MHz
  • Core Size
    8-Bit
  • Core Processor
    S08
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Discontinued at Digi-Key
  • Series
    S08
The MC9S08QG8MDNE integrated circuit chips, also known as microcontrollers, offer several advantages and can be applied in various scenarios:1. Low power consumption: MC9S08QG8MDNE chips are designed to operate at low power, making them suitable for battery-powered applications or any application with power constraints.2. Small form factor: MC9S08QG8MDNE chips come in small packages, making them ideal for applications where space is limited, such as wearable devices or small embedded systems.3. Cost-effective: These microcontrollers are cost-effective as they integrate several essential components such as a central processing unit (CPU), memory, and I/O peripherals on a single chip, reducing the need for additional components and saving costs.4. Scalability and versatility: MC9S08QG8MDNE chips are part of the S08 family of microcontrollers, known for their scalability and versatility. They can be used for a wide range of applications, from simple control tasks to more complex ones that require higher processing power.5. Communication capabilities: These microcontrollers have built-in communication interfaces such as SPI, I2C, UART, and CAN, enabling them to connect to other devices or communicate with external components in various applications, including industrial automation, home automation, and IoT devices.6. Peripherals: MC9S08QG8MDNE chips offer a range of integrated peripherals, including timers, analog-to-digital converters (ADC), digital-to-analog converters (DAC), and GPIO pins. These peripherals facilitate the integration and control of external sensors, actuators, and other devices in different applications.7. Development tools and ecosystem: The MC9S08QG8MDNE chips are supported by a comprehensive development ecosystem, including software development tools, libraries, and community support. This makes it easier for developers to design, program, and debug applications using these microcontrollers.Application scenarios for MC9S08QG8MDNE chips can include:1. Home automation: These microcontrollers can be used in smart home applications to control lighting, thermostat, security systems, and other home devices.2. Industrial automation: MC9S08QG8MDNE chips can be applied in industrial control systems, such as motor control, robotic systems, and process automation.3. IoT devices: With their low power consumption, small form factor, and communication capabilities, these microcontrollers are suitable for IoT applications, including smart sensors, wearable devices, and remote monitoring systems.4. Consumer electronics: MC9S08QG8MDNE chips can be utilized in various consumer electronics, such as wearable fitness trackers, smart appliances, and remote controls.5. Automotive: These microcontrollers can be used for automotive applications, including dashboard control, body control modules, and engine management systems.6. Medical devices: MC9S08QG8MDNE chips can be integrated into medical devices like patient monitoring systems, infusion pumps, and diagnostic equipment.These are just a few examples, and the versatility of MC9S08QG8MDNE microcontrollers allows them to be utilized in various other applications where low power, small size, and integrated features are required.