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MC68HC705C9AFNE

MC68HC705C9AFNE

Manufacturer No:

MC68HC705C9AFNE

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 16KB OTP 44PLCC

Datasheet:

Datasheet

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MC68HC705C9AFNE Specifications

  • Type
    Parameter
  • Number of I/O
    24
  • Supplier Device Package
    44-PLCC (16.59x16.59)
  • Package / Case
    44-LCC (J-Lead)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 5.5V
  • RAM Size
    352 x 8
  • EEPROM Size
    -
  • Program Memory Type
    OTP
  • Program Memory Size
    16KB (16K x 8)
  • Peripherals
    POR, WDT
  • Connectivity
    SCI, SPI
  • Speed
    2.1MHz
  • Core Size
    8-Bit
  • Core Processor
    HC05
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    HC05
The PEF2256EV2.2 integrated circuit chips have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The PEF2256EV2.2 chips offer high-performance digital signal processing capabilities, enabling efficient and reliable data processing. 2. Versatility: These chips support various voice and audio processing algorithms, making them suitable for a wide range of applications. 3. Low Power Consumption: The PEF2256EV2.2 chips are designed to operate with low power consumption, making them energy-efficient and suitable for battery-powered devices. 4. Integrated Features: These chips integrate multiple features such as echo cancellation, noise reduction, and voice recognition, reducing the need for additional external components. 5. Flexibility: The PEF2256EV2.2 chips can be easily programmed and configured to meet specific application requirements.Application Scenarios: 1. Voice Communication Systems: These chips are commonly used in voice communication systems, including telephony, VoIP (Voice over Internet Protocol), and video conferencing systems. They enhance voice quality, reduce background noise, and improve overall communication experience. 2. Audio Processing Devices: The PEF2256EV2.2 chips find applications in audio processing devices such as soundbars, audio conferencing systems, and audio mixers. They enable advanced audio algorithms for noise reduction, echo cancellation, and audio enhancement. 3. Smart Home Devices: These chips can be integrated into smart home devices like voice assistants, smart speakers, and home automation systems. They enhance voice recognition capabilities and improve the overall audio experience. 4. Automotive Systems: The PEF2256EV2.2 chips are used in automotive systems for hands-free calling, voice-controlled infotainment systems, and noise cancellation in car audio systems. 5. Industrial Applications: These chips find applications in industrial environments where voice communication is critical, such as intercom systems, public address systems, and industrial control systems.Overall, the PEF2256EV2.2 integrated circuit chips offer high-performance voice and audio processing capabilities, making them suitable for a wide range of applications in various industries.
MC68HC705C9AFNE Relevant information