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MC9S08LC36LH

MC9S08LC36LH

Manufacturer No:

MC9S08LC36LH

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 36KB FLASH 64LQFP

Datasheet:

Datasheet

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MC9S08LC36LH Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-LQFP (10x10)
  • Package / Case
    64-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 2x12b
  • Voltage - Supply (Vcc/Vdd)
    1.8V ~ 3.6V
  • RAM Size
    2.5K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    36KB (36K x 8)
  • Number of I/O
    18
  • Peripherals
    LCD, LVD, POR, PWM, WDT
  • Connectivity
    I²C, SCI, SPI
  • Speed
    40MHz
  • Core Size
    8-Bit
  • Core Processor
    S08
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    S08
The MC9S08LC36LH integrated circuit chips, from the S08LC family of microcontrollers by NXP Semiconductor, provide a range of advantages and find applications in various scenarios. Some of the advantages and application scenarios are:1. Low-power operation: The MC9S08LC36LH chips are designed for low-power applications, making them suitable for battery-powered devices or systems where power efficiency is crucial.2. Integration: These chips integrate a wide range of peripherals such as analog-to-digital converters (ADCs), timers, UARTs, I2C, SPI, and more. This integration simplifies system design and reduces the overall component count.3. Small form factor: With a small package size, the MC9S08LC36LH chips are ideal for applications where space is limited, such as wearable devices or small IoT nodes.4. Advanced security features: The chips offer advanced security features like secure key storage and hardware encryption, making them suitable for applications that require secure communication or data protection.5. Industrial applications: The MC9S08LC36LH chips are designed to meet the stringent requirements of industrial environments, including extended temperature ranges, high resistance to electromagnetic interference (EMI), and robustness against vibrations.6. Motor control applications: These chips support multiple pulse-width modulation (PWM) channels and have built-in motor control peripherals, making them suitable for applications such as motor control, robotics, or drones.7. Human-machine interface (HMI): With integrated capacitive touch-sensing support, the MC9S08LC36LH chips can be used in HMI applications, including touch panels or control interfaces.8. Consumer electronics: Their low-power consumption, small footprint, and integration make these chips suitable for various consumer electronics applications like fitness trackers, smartwatches, remote controls, and more.9. Internet of Things (IoT): The MC9S08LC36LH chips can be used in IoT applications due to their low-power operation, integration of communication interfaces like I2C and SPI, and support for wireless protocols like Bluetooth or Wi-Fi through external components.Overall, the MC9S08LC36LH chips provide a good balance of performance, low-power operation, integration, and security features, making them suitable for a wide range of applications in different industries.
MC9S08LC36LH Relevant information