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MCP11A1CFNE3R

MCP11A1CFNE3R

Manufacturer No:

MCP11A1CFNE3R

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT ROMLESS 52PLCC

Datasheet:

Datasheet

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MCP11A1CFNE3R Specifications

  • Type
    Parameter
  • Supplier Device Package
    52-PLCC (19.1x19.1)
  • Package / Case
    52-LCC (J-Lead)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 8x8b
  • Voltage - Supply (Vcc/Vdd)
    4.5V ~ 5.5V
  • RAM Size
    256 x 8
  • EEPROM Size
    512 x 8
  • Program Memory Type
    ROMless
  • Program Memory Size
    -
  • Number of I/O
    38
  • Peripherals
    POR, WDT
  • Connectivity
    SCI, SPI
  • Speed
    3MHz
  • Core Size
    8-Bit
  • Core Processor
    HC11
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    HC11
The MSP430BT5190IPZR is an integrated circuit chip from Texas Instruments, specifically designed for Bluetooth Low Energy (BLE) applications. It offers several advantages and can be used in various application scenarios:1. Low Power Consumption: The MSP430BT5190IPZR is optimized for low power consumption, making it ideal for battery-powered devices. It has multiple power-saving modes and can operate for extended periods on a small battery.2. Bluetooth Low Energy (BLE) Support: The chip supports the BLE protocol, which is designed for short-range wireless communication with low power requirements. It enables devices to connect and exchange data with smartphones, tablets, and other BLE-enabled devices.3. Integrated Peripherals: The chip includes various integrated peripherals, such as timers, UART, SPI, I2C, and ADC, which provide flexibility and ease of integration with other components in the system.4. Security Features: The MSP430BT5190IPZR offers built-in security features like AES encryption and a random number generator, ensuring secure communication between devices.5. Small Form Factor: The chip comes in a small package, making it suitable for space-constrained applications where size is a critical factor.Application Scenarios:1. Internet of Things (IoT) Devices: The MSP430BT5190IPZR can be used in IoT devices that require low power consumption and wireless connectivity. It can enable communication between IoT devices and smartphones, allowing users to control and monitor their devices remotely.2. Wearable Devices: Due to its low power consumption and small form factor, the chip is suitable for wearable devices like fitness trackers, smartwatches, and health monitoring devices. It can connect to smartphones and transmit data, enabling users to track their health and fitness metrics.3. Home Automation: The chip can be used in home automation systems to enable wireless control and monitoring of various devices, such as lights, thermostats, and security systems. It allows users to control their home devices remotely using a smartphone or tablet.4. Industrial Monitoring: The MSP430BT5190IPZR can be utilized in industrial applications for monitoring and controlling various parameters, such as temperature, humidity, and pressure. It enables wireless communication between sensors and a central control system, reducing the need for wired connections.5. Asset Tracking: The chip can be used in asset tracking systems to monitor the location and status of assets. It can enable wireless communication between tracking devices and a central monitoring system, providing real-time updates on asset location and condition.Overall, the MSP430BT5190IPZR integrated circuit chip offers low power consumption, BLE support, integrated peripherals, and security features, making it suitable for a wide range of applications requiring wireless connectivity and low power consumption.
MCP11A1CFNE3R Relevant information