Home / Microcontrollers / LPC2132FHN64/01,55/
LPC2132FHN64/01,55

LPC2132FHN64/01,55

Manufacturer No:

LPC2132FHN64/01,55

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16/32B 64KB FLASH 64HVQFN

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

LPC2132FHN64/01,55 Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-HVQFN (9x9)
  • Package / Case
    64-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 8x10b; D/A 1x10b
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 3.6V
  • RAM Size
    16K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    64KB (64K x 8)
  • Number of I/O
    47
  • Peripherals
    Brown-out Detect/Reset, POR, PWM, WDT
  • Connectivity
    I²C, Microwire, SPI, SSI, SSP, UART/USART
  • Speed
    60MHz
  • Core Size
    16/32-Bit
  • Core Processor
    ARM7®
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    LPC2100
The UPD70F3470GCA1-UEU-X2-D-G integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance: The chips are designed to deliver high performance with a 32-bit RISC CPU core, capable of executing instructions at high speeds. 2. Low power consumption: The chips are optimized for low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Rich peripheral functions: The chips offer a wide range of built-in peripheral functions such as timers, serial interfaces, analog-to-digital converters, and more, reducing the need for external components. 4. Enhanced security features: The chips come with security features like a memory protection unit and a hardware encryption engine, ensuring data security in applications that require it. 5. Ample memory capacity: The chips have a large memory capacity, including flash memory for program storage and RAM for data storage, enabling the development of complex applications.Application Scenarios: 1. Industrial automation: The chips can be used in industrial automation systems for controlling and monitoring various processes, thanks to their high performance, low power consumption, and rich peripheral functions. 2. Automotive electronics: The chips find applications in automotive electronics, such as engine control units, dashboard systems, and advanced driver-assistance systems (ADAS), due to their robustness, security features, and memory capacity. 3. Consumer electronics: The chips can be utilized in consumer electronics devices like home appliances, gaming consoles, and audio/video equipment, benefiting from their low power consumption, high performance, and memory capacity. 4. Internet of Things (IoT): The chips are suitable for IoT applications, where they can be used in smart devices, sensors, and gateways, leveraging their low power consumption, security features, and connectivity options. 5. Medical devices: The chips can be employed in medical devices like patient monitoring systems, diagnostic equipment, and implantable devices, taking advantage of their high performance, security features, and memory capacity.Overall, the UPD70F3470GCA1-UEU-X2-D-G integrated circuit chips offer a combination of performance, power efficiency, security, and memory capacity, making them suitable for a wide range of applications in various industries.
LPC2132FHN64/01,55 Relevant information