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MPC562MZP66R2

MPC562MZP66R2

Manufacturer No:

MPC562MZP66R2

Manufacturer:

NXP USA Inc.

Description:

IC MCU 32BIT ROMLESS 388PBGA

Datasheet:

Datasheet

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MPC562MZP66R2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    388-PBGA (27x27)
  • Package / Case
    388-BBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 32x10b
  • Voltage - Supply (Vcc/Vdd)
    2.5V ~ 2.7V
  • RAM Size
    32K x 8
  • EEPROM Size
    -
  • Program Memory Type
    ROMless
  • Program Memory Size
    -
  • Number of I/O
    64
  • Peripherals
    POR, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, SCI, SPI, UART/USART
  • Speed
    66MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    PowerPC
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    MPC5xx
The DF2210CUNP24WV integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Integration: These chips are highly integrated, which means they can perform multiple functions in a single chip, reducing the need for external components and saving space on the circuit board. 2. Low Power Consumption: The chips are designed to operate at low power, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Wide Voltage Range: The chips can operate within a wide voltage range, making them compatible with various power supply systems. 4. High Performance: These chips offer high performance in terms of speed, accuracy, and reliability, making them suitable for demanding applications. 5. Cost-Effective: The integration of multiple functions in a single chip reduces the overall cost of the system, making it an economical choice for many applications.Application Scenarios: 1. Internet of Things (IoT): The DF2210CUNP24WV chips can be used in IoT devices such as smart home systems, wearable devices, and industrial sensors, where low power consumption, high integration, and reliability are essential. 2. Consumer Electronics: These chips can be used in various consumer electronic devices such as smartphones, tablets, and digital cameras, where space-saving, low power consumption, and high performance are required. 3. Industrial Automation: The chips can be used in industrial automation systems for controlling and monitoring processes, where high reliability, accuracy, and integration are crucial. 4. Automotive Electronics: These chips can be used in automotive applications such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS), where high performance, low power consumption, and reliability are necessary. 5. Medical Devices: The chips can be used in medical devices such as patient monitoring systems, diagnostic equipment, and implantable devices, where low power consumption, high integration, and accuracy are important.Overall, the DF2210CUNP24WV integrated circuit chips offer a range of advantages and can be applied in various scenarios where high integration, low power consumption, and high performance are required.
MPC562MZP66R2 Relevant information