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MMC2001HCAB33B

MMC2001HCAB33B

Manufacturer No:

MMC2001HCAB33B

Manufacturer:

NXP USA Inc.

Description:

IC MCU 32BIT 256KB ROM 144LQFP

Datasheet:

Datasheet

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MMC2001HCAB33B Specifications

  • Type
    Parameter
  • Supplier Device Package
    144-LQFP (20x20)
  • Package / Case
    144-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    1.8V ~ 3.6V
  • RAM Size
    32K x 8
  • EEPROM Size
    -
  • Program Memory Type
    ROM
  • Program Memory Size
    256KB (256K x 8)
  • Number of I/O
    24
  • Peripherals
    POR, PWM, WDT
  • Connectivity
    EBI/EMI, SPI, UART/USART
  • Speed
    33MHz
  • Core Size
    16/32-Bit
  • Core Processor
    M210
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MCore
The MMC2001HCAB33B integrated circuit chips have several advantages and application scenarios:Advantages: 1. High integration: The MMC2001HCAB33B chips are highly integrated, which means they can perform multiple functions in a single chip. This reduces the need for additional components and simplifies the overall circuit design. 2. Low power consumption: These chips are designed to operate with low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Wide operating voltage range: The chips can operate within a wide voltage range, typically from 1.8V to 5.5V. This flexibility allows them to be used in various electronic systems. 4. Small form factor: The MMC2001HCAB33B chips are available in small packages, making them suitable for space-constrained applications or devices where miniaturization is required. 5. High reliability: These chips are designed to be highly reliable, ensuring stable and consistent performance over time.Application scenarios: 1. Consumer electronics: The MMC2001HCAB33B chips can be used in various consumer electronic devices such as smartphones, tablets, wearables, and portable audio players. They can perform functions like power management, voltage regulation, and signal conditioning. 2. Internet of Things (IoT): These chips can be used in IoT devices that require low power consumption and small form factor. They can be used for sensor nodes, smart home devices, and other IoT applications. 3. Industrial automation: The chips can be used in industrial automation systems for controlling and monitoring various processes. They can be used for motor control, power management, and communication interfaces. 4. Medical devices: The MMC2001HCAB33B chips can be used in medical devices such as portable medical monitors, insulin pumps, and diagnostic equipment. They can provide power management and signal conditioning functions. 5. Automotive electronics: These chips can be used in automotive electronics for various applications like power management, sensor interfaces, and control systems.Overall, the MMC2001HCAB33B integrated circuit chips offer high integration, low power consumption, and small form factor, making them suitable for a wide range of applications in consumer electronics, IoT, industrial automation, medical devices, and automotive electronics.
MMC2001HCAB33B Relevant information