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MCF5272VF66R2

MCF5272VF66R2

Manufacturer No:

MCF5272VF66R2

Manufacturer:

NXP USA Inc.

Description:

IC MCU 32BIT 16KB ROM 196MAPBGA

Datasheet:

Datasheet

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MCF5272VF66R2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    196-LBGA (15x15)
  • Package / Case
    196-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Oscillator Type
    External
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 3.6V
  • RAM Size
    1K x 32
  • EEPROM Size
    -
  • Program Memory Type
    ROM
  • Program Memory Size
    16KB (4K x 32)
  • Number of I/O
    32
  • Peripherals
    DMA, WDT
  • Connectivity
    EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
  • Speed
    66MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    Coldfire V2
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    MCF527x
The UPD70F3508GJA2-GBG-SSA-AX integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The UPD70F3508GJA2-GBG-SSA-AX chips offer high processing power and performance, making them suitable for demanding applications. 2. Low Power Consumption: These chips are designed to operate efficiently with low power consumption, making them ideal for battery-powered devices or energy-efficient applications. 3. Integrated Peripherals: The chips come with various integrated peripherals such as timers, UART, I2C, SPI, and ADC, reducing the need for external components and simplifying the overall design. 4. Enhanced Security: The UPD70F3508GJA2-GBG-SSA-AX chips provide advanced security features like memory protection, encryption, and tamper detection, ensuring the safety of sensitive data. 5. Wide Operating Temperature Range: These chips can operate reliably in a wide temperature range, making them suitable for industrial applications that require robust performance in harsh environments.Application Scenarios: 1. Automotive Electronics: The UPD70F3508GJA2-GBG-SSA-AX chips are commonly used in automotive applications such as engine control units (ECUs), airbag systems, anti-lock braking systems (ABS), and dashboard displays. 2. Industrial Automation: These chips find applications in industrial automation systems, including programmable logic controllers (PLCs), motor control units, and factory automation equipment. 3. Consumer Electronics: The chips can be used in various consumer electronic devices like home appliances, gaming consoles, audio/video equipment, and smart home devices. 4. Medical Devices: The UPD70F3508GJA2-GBG-SSA-AX chips are suitable for medical devices such as patient monitoring systems, diagnostic equipment, and medical imaging devices. 5. Internet of Things (IoT): These chips can be utilized in IoT devices, enabling connectivity, data processing, and control in smart cities, smart homes, and industrial IoT applications.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or product being developed.
MCF5272VF66R2 Relevant information