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MC9S12XDT512VAL

MC9S12XDT512VAL

Manufacturer No:

MC9S12XDT512VAL

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16BIT 512KB FLASH 112LQFP

Datasheet:

Datasheet

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MC9S12XDT512VAL Specifications

  • Type
    Parameter
  • Supplier Device Package
    112-LQFP (20x20)
  • Package / Case
    112-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 16x10b
  • Voltage - Supply (Vcc/Vdd)
    2.35V ~ 5.5V
  • RAM Size
    20K x 8
  • EEPROM Size
    4K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    512KB (512K x 8)
  • Number of I/O
    91
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
  • Speed
    80MHz
  • Core Size
    16-Bit
  • Core Processor
    HCS12X
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    HCS12X
The R7F7016424ABG-C#HC1 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance: The chips are based on the Arm Cortex-M4F core, which offers high processing power and performance. 2. Low power consumption: The chips are designed to operate at low power, making them suitable for battery-powered devices and energy-efficient applications. 3. Rich peripheral set: The chips come with a wide range of peripherals, including UART, SPI, I2C, ADC, PWM, and timers, enabling easy integration with various external devices. 4. Secure: The chips have built-in security features like a hardware encryption engine, memory protection unit, and secure boot, ensuring data integrity and system security. 5. Extensive memory options: The chips offer a variety of memory options, including Flash memory for program storage and SRAM for data storage, allowing for flexible memory configurations.Application scenarios: 1. Internet of Things (IoT): The chips are suitable for IoT applications due to their low power consumption, high performance, and secure features. They can be used in smart home devices, wearable devices, industrial sensors, and other IoT applications. 2. Industrial automation: The chips can be used in industrial automation systems for controlling and monitoring various processes. Their high-performance capabilities and rich peripheral set make them suitable for applications like motor control, PLCs, and robotics. 3. Consumer electronics: The chips can be used in various consumer electronic devices like smartwatches, fitness trackers, home appliances, and gaming consoles. Their low power consumption and high-performance features make them ideal for such applications. 4. Automotive: The chips can be used in automotive applications like advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs). Their secure features and high-performance capabilities make them suitable for automotive safety and control applications. 5. Medical devices: The chips can be used in medical devices like patient monitoring systems, medical imaging equipment, and portable medical devices. Their low power consumption, high performance, and secure features make them suitable for medical applications.Overall, the R7F7016424ABG-C#HC1 integrated circuit chips offer a combination of high performance, low power consumption, rich peripherals, and security features, making them suitable for a wide range of applications in various industries.
MC9S12XDT512VAL Relevant information