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MC9S12XDT512VAG

MC9S12XDT512VAG

Manufacturer No:

MC9S12XDT512VAG

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16BIT 512KB FLASH 144LQFP

Datasheet:

Datasheet

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MC9S12XDT512VAG Specifications

  • Type
    Parameter
  • Supplier Device Package
    144-LQFP (20x20)
  • Package / Case
    144-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 24x10b
  • Voltage - Supply (Vcc/Vdd)
    2.35V ~ 5.5V
  • RAM Size
    20K x 8
  • EEPROM Size
    4K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    512KB (512K x 8)
  • Number of I/O
    119
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
  • Speed
    80MHz
  • Core Size
    16-Bit
  • Core Processor
    HCS12X
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    HCS12X
The MC9S12XDT512VAG is a microcontroller integrated circuit chip developed by NXP Semiconductors. It belongs to the S12X family of microcontrollers and offers several advantages and application scenarios. Some of them include:1. High Performance: The MC9S12XDT512VAG chip is built on a 16-bit S12X CPU core, which provides high processing power and performance. It operates at a clock frequency of up to 50 MHz, enabling it to handle complex tasks efficiently.2. Large Memory Capacity: This chip has a large memory capacity, with 512 KB of flash memory for program storage and 48 KB of RAM for data storage. The ample memory allows for the implementation of complex algorithms and the storage of large amounts of data.3. Enhanced Connectivity: The MC9S12XDT512VAG chip offers various communication interfaces, including CAN (Controller Area Network), SCI (Serial Communication Interface), SPI (Serial Peripheral Interface), and I2C (Inter-Integrated Circuit). These interfaces enable seamless connectivity with other devices and systems, making it suitable for applications requiring communication capabilities.4. Integrated Peripherals: The chip incorporates several integrated peripherals, such as timers, PWM (Pulse Width Modulation) modules, ADC (Analog-to-Digital Converter), and GPIO (General Purpose Input/Output) pins. These peripherals enhance the chip's versatility and make it suitable for a wide range of applications.5. Automotive Applications: The MC9S12XDT512VAG chip is specifically designed for automotive applications. It meets the stringent requirements of the automotive industry, including temperature range, electromagnetic compatibility, and reliability. It can be used in various automotive systems, such as engine control units, body control modules, and instrument clusters.6. Industrial Control Systems: The high performance and connectivity features of the MC9S12XDT512VAG chip make it suitable for industrial control systems. It can be used in applications such as factory automation, robotics, and process control, where real-time processing, communication, and control are essential.7. Consumer Electronics: The chip's capabilities also make it suitable for consumer electronics applications. It can be used in devices such as home automation systems, smart appliances, and gaming consoles, where a combination of processing power, connectivity, and memory capacity is required.Overall, the MC9S12XDT512VAG chip offers high performance, ample memory, connectivity options, and integrated peripherals, making it suitable for a wide range of applications, particularly in the automotive, industrial, and consumer electronics sectors.
MC9S12XDT512VAG Relevant information