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MC9S12XDT256CAG

MC9S12XDT256CAG

Manufacturer No:

MC9S12XDT256CAG

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16BIT 256KB FLASH 144LQFP

Datasheet:

Datasheet

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MC9S12XDT256CAG Specifications

  • Type
    Parameter
  • Supplier Device Package
    144-LQFP (20x20)
  • Package / Case
    144-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 24x10b
  • Voltage - Supply (Vcc/Vdd)
    2.35V ~ 5.5V
  • RAM Size
    16K x 8
  • EEPROM Size
    4K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    256KB (256K x 8)
  • Number of I/O
    119
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
  • Speed
    80MHz
  • Core Size
    16-Bit
  • Core Processor
    HCS12X
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    HCS12X
The MC9S12XDT256CAG is a microcontroller integrated circuit chip developed by NXP Semiconductors. It belongs to the S12X family of microcontrollers and offers several advantages and application scenarios. Some of them include:1. High Performance: The MC9S12XDT256CAG chip is based on the 16-bit S12X core, which provides high processing power and performance. It operates at a maximum frequency of 50 MHz, allowing for efficient execution of complex tasks.2. Large Memory Capacity: This chip has a large memory capacity, with 256 KB of flash memory for program storage and 12 KB of RAM for data storage. The ample memory space enables the implementation of sophisticated algorithms and data-intensive applications.3. Enhanced Connectivity: The MC9S12XDT256CAG chip offers various communication interfaces, including CAN (Controller Area Network), SCI (Serial Communication Interface), SPI (Serial Peripheral Interface), and I2C (Inter-Integrated Circuit). These interfaces facilitate seamless connectivity with other devices and systems.4. Rich Peripherals: The chip incorporates a wide range of peripherals, such as timers, PWM (Pulse Width Modulation) modules, ADC (Analog-to-Digital Converter), and GPIO (General Purpose Input/Output) pins. These peripherals enable the integration of various sensors, actuators, and other external components.5. Automotive Applications: The MC9S12XDT256CAG chip is commonly used in automotive applications due to its robustness, reliability, and support for automotive-specific communication protocols like CAN. It can be employed in engine control units, body control modules, instrument clusters, and other automotive systems.6. Industrial Control Systems: The high performance and connectivity features of this chip make it suitable for industrial control applications. It can be used in programmable logic controllers (PLCs), motor control systems, factory automation, and other industrial control systems.7. Consumer Electronics: The MC9S12XDT256CAG chip can also find applications in consumer electronics devices. Its processing power, memory capacity, and communication interfaces make it suitable for applications like home automation, smart appliances, and multimedia systems.8. Medical Devices: The chip's reliability, real-time capabilities, and connectivity options make it suitable for medical device applications. It can be used in patient monitoring systems, medical imaging devices, and other healthcare equipment.Overall, the MC9S12XDT256CAG chip offers high performance, ample memory, connectivity options, and a wide range of peripherals, making it suitable for various applications in automotive, industrial, consumer electronics, and medical domains.
MC9S12XDT256CAG Relevant information