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MC9S12T64MPKE16

MC9S12T64MPKE16

Manufacturer No:

MC9S12T64MPKE16

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16BIT 64KB FLASH 80FQFP

Datasheet:

Datasheet

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MC9S12T64MPKE16 Specifications

  • Type
    Parameter
  • Supplier Device Package
    80-FQFP (12x12)
  • Package / Case
    80-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 8x10b
  • Voltage - Supply (Vcc/Vdd)
    2.25V ~ 2.75V
  • RAM Size
    2K x 8
  • EEPROM Size
    2K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    64KB (64K x 8)
  • Number of I/O
    59
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    EBI/EMI, SCI, SPI
  • Speed
    16MHz
  • Core Size
    16-Bit
  • Core Processor
    HCS12
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    HCS12
The MC9S12T64MPKE16 is a microcontroller integrated circuit chip developed by NXP Semiconductors. It belongs to the S12 MagniV family and offers several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The MC9S12T64MPKE16 is built on a 16-bit S12X CPU core, providing high processing power and performance for various applications. 2. Integrated Peripherals: It includes a wide range of integrated peripherals such as analog-to-digital converters (ADC), timers, serial communication interfaces (SCI, SPI, I2C), pulse-width modulation (PWM), and more. These peripherals enhance the chip's functionality and make it suitable for diverse applications. 3. Enhanced Security: The chip incorporates security features like memory protection units (MPU) and flash block protection, ensuring data integrity and protection against unauthorized access. 4. Low Power Consumption: The MC9S12T64MPKE16 is designed to operate at low power, making it suitable for battery-powered applications or devices where power efficiency is crucial. 5. Robust Connectivity: It supports various communication protocols like CAN (Controller Area Network), LIN (Local Interconnect Network), and SCI (Serial Communication Interface), enabling seamless connectivity with other devices or systems.Application Scenarios: 1. Automotive Systems: The MC9S12T64MPKE16 is widely used in automotive applications such as engine control units (ECU), body control modules (BCM), airbag systems, instrument clusters, and more. Its robust features, connectivity options, and security make it suitable for automotive electronics. 2. Industrial Control Systems: The chip can be utilized in industrial control systems, including factory automation, process control, robotics, and monitoring systems. Its high performance, integrated peripherals, and connectivity options enable efficient control and monitoring of industrial processes. 3. Consumer Electronics: The MC9S12T64MPKE16 can be employed in various consumer electronic devices like home appliances, gaming consoles, audio systems, and more. Its low power consumption, connectivity options, and integrated peripherals make it suitable for such applications. 4. Internet of Things (IoT): With its connectivity features like CAN, LIN, and SCI, the chip can be used in IoT devices and applications. It can serve as a controller or gateway for IoT nodes, enabling communication and data processing in IoT networks.These are just a few examples of the advantages and application scenarios of the MC9S12T64MPKE16 integrated circuit chips. Its versatility, performance, and integrated features make it suitable for a wide range of applications in various industries.
MC9S12T64MPKE16 Relevant information