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MC9S12KT256MPVE

MC9S12KT256MPVE

Manufacturer No:

MC9S12KT256MPVE

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16BIT 256KB FLASH 112LQFP

Datasheet:

Datasheet

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MC9S12KT256MPVE Specifications

  • Type
    Parameter
  • Supplier Device Package
    112-LQFP (20x20)
  • Package / Case
    112-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 16x10b
  • Voltage - Supply (Vcc/Vdd)
    2.35V ~ 5.5V
  • RAM Size
    12K x 8
  • EEPROM Size
    4K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    256KB (256K x 8)
  • Number of I/O
    91
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, I²C, SCI, SPI
  • Speed
    25MHz
  • Core Size
    16-Bit
  • Core Processor
    HCS12
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    HCS12
The R5F109LDKFB#V0 is a specific model of integrated circuit (IC) chip developed by Renesas Electronics Corporation. While specific advantages and application scenarios may vary depending on the requirements and use cases, here are some general advantages and potential application scenarios for the R5F109LDKFB#V0:Advantages: 1. High-performance: The R5F109LDKFB#V0 is designed to deliver high-performance computing capabilities, making it suitable for applications that require fast and efficient processing. 2. Low power consumption: The chip is optimized for low power consumption, making it suitable for battery-powered devices or applications where energy efficiency is crucial. 3. Integrated peripherals: The R5F109LDKFB#V0 comes with a range of integrated peripherals such as timers, UART, I2C, SPI, ADC, etc., which simplifies the design process and reduces the need for external components. 4. Rich development ecosystem: Renesas provides a comprehensive development ecosystem, including software development tools, libraries, and support, which can accelerate the development process and reduce time-to-market.Application Scenarios: 1. Internet of Things (IoT) devices: The R5F109LDKFB#V0 can be used in IoT devices that require low power consumption, connectivity options (such as UART, I2C, SPI), and processing capabilities for data acquisition, control, and communication. 2. Industrial automation: The chip can be utilized in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. 3. Consumer electronics: The R5F109LDKFB#V0 can be employed in various consumer electronic devices like smart appliances, wearable devices, or home automation systems, where low power consumption and high-performance computing are essential. 4. Automotive applications: The chip can be used in automotive applications such as engine control units (ECUs), body control modules (BCMs), or infotainment systems, where reliability, real-time processing, and connectivity are crucial.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and capabilities of the R5F109LDKFB#V0 chip, and it is recommended to refer to the manufacturer's documentation and specifications for detailed information.
MC9S12KT256MPVE Relevant information