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MC9S08RE16FDE

MC9S08RE16FDE

Manufacturer No:

MC9S08RE16FDE

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 16KB FLASH 48QFN

Datasheet:

Datasheet

Delivery:

Payment:

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MC9S08RE16FDE Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-QFN-EP (7x7)
  • Package / Case
    48-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    1.8V ~ 3.6V
  • RAM Size
    1K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    16KB (16K x 8)
  • Number of I/O
    39
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    SCI
  • Speed
    8MHz
  • Core Size
    8-Bit
  • Core Processor
    S08
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    S08
The UPD70F3840GB(R)-GAH-SSA-AX is a specific model of integrated circuit chip manufactured by Renesas Electronics. While specific advantages and application scenarios may vary depending on the requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The UPD70F3840GB(R)-GAH-SSA-AX chip offers high-performance processing capabilities, making it suitable for demanding applications. 2. Low Power Consumption: It is designed to operate with low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 3. Integrated Peripherals: The chip integrates various peripherals such as timers, serial interfaces, analog-to-digital converters, and more, reducing the need for external components and simplifying the overall system design. 4. Ample Memory: It provides a significant amount of on-chip memory, including flash memory for program storage and RAM for data storage, enabling complex applications and data processing. 5. Robust Connectivity: The chip supports various communication interfaces like UART, SPI, I2C, CAN, etc., facilitating connectivity with other devices or systems.Application Scenarios: 1. Industrial Automation: The UPD70F3840GB(R)-GAH-SSA-AX chip can be used in industrial automation systems for controlling and monitoring processes, interfacing with sensors and actuators, and executing complex algorithms. 2. Automotive Electronics: It can be employed in automotive applications such as engine control units (ECUs), body control modules (BCMs), or infotainment systems, where high performance, low power consumption, and robust connectivity are crucial. 3. Consumer Electronics: The chip can find applications in consumer electronics devices like home appliances, gaming consoles, or audio/video equipment, where it can provide processing power, memory, and connectivity features. 4. Internet of Things (IoT): With its low power consumption and integrated peripherals, the chip can be utilized in IoT devices for data acquisition, processing, and communication with other IoT nodes or cloud platforms. 5. Medical Devices: The chip's high performance and integrated features make it suitable for medical devices like patient monitoring systems, diagnostic equipment, or medical imaging devices.It's important to note that the specific advantages and application scenarios may vary depending on the requirements, and it is recommended to refer to the manufacturer's documentation and datasheet for detailed information about the UPD70F3840GB(R)-GAH-SSA-AX chip.
MC9S08RE16FDE Relevant information